
Development and manufacturing of passive electronic components, camera modules and semiconductor substrates.

Samsung Electro-Mechanics Co., Ltd.
Suwon (headquarters) · Sejong · Busan · Tianjin · Goxin (CN) · Calamba (PH) · Thailand · VietnamNew on Amplifa
About Samsung Electro-Mechanics
Samsung Electro-Mechanics is a South Korean manufacturer of electronic components founded in 1973 and headquartered in Suwon. The company produces passive components such as MLCCs (Multilayer Ceramic Capacitors), inductors, chip resistors, tantalum and silicon capacitors as well as camera modules and package substrates for semiconductors. Manufacturing covers ceramic multilayer technologies, thin films, precision optics in glass and plastic, as well as assembly and packaging technology for electronic modules. Fields of application are Automotive/E-Mobility, computers, displays, mobile communications, wearables, AI servers, network, SSD and tablets. Production facilities are located, among others, in Sejong and Busan (South Korea), Tianjin and Goxin (China), Calamba (Philippines), Thailand and Vietnam; since 2021 the company has invested around 1.9 trillion KRW in the semiconductor package substrate business in Busan.
- Site
- Suwon, Gyeonggi-do
- Processes
- MLCC manufacturing (Multilayer Ceramic Capacitor, SMD chip components), Silicon capacitor manufacturing (semiconductor capacitor), Tantalum capacitor manufacturing, Power inductor (coil) manufacturing, Chip resistor (SMD resistor) manufacturing, Package substrate (IC substrates, FOPLP, SoS System on Substrate) manufacturing, PCB / MLB (Multi Layer Board, rigid-flex printed circuit boards) manufacturing, Camera module manufacturing (including triple camera, folded zoom, weather-proof automotive)
- Materials
- Silicon, Tantalum, Ceramic (MLCC C0G type), Copper, Nickel, Ceramic (C0G Cu/Ni type), Glass & Plastic (Lenses)
- Certificates
- ISO 9001, IATF 16949, ISO 14001, ISO 45001, ISO 50001, ISO 22301, ISO 27001, TISAX, ISO 21434, QC 080000, Family-friendly company certification, Web Accessibility Quality Certificate
- Founded
- 1973
- Employees
- 36490
- Industries
- Automotive/E-Mobility, Computer, Display, Mobile communications, Wearables, AI servers
- 01
Material and product development
- 02
Manufacturing of passive components (MLCCs, inductors, resistors, capacitors)
- 03
Package substrates / printed circuit board manufacturing
- 04
Camera and module assembly
- 05
Quality inspection
- 06
Worldwide sales and customer support
Materials & Processes
Ceramic (C0G Cu/Ni type)
Ceramic multilayer technology for MLCC capacitors, including SMD chip components for automotive and IT applications.
Silicon
Base material for silicon capacitors with high capacitance density for high-frequency and high-temperature applications.
Tantalum
Material for tantalum capacitors in compact designs.
Copper
Electrode and conductor material in MLCC and substrate manufacturing.
Nickel
Electrode material, among others for nickel-electrode MLCC types.
Glass & Plastic (Lenses)
Materials for lenses in camera modules, including all-weather automotive modules.
Locations

Suwon
KRHeadquarters: administration, R&D
- Automated production systems for ceramic capacitors (since 1979/1980)
Sejong
KRProduction
Busan
KRProduction: semiconductor substrates, chip inductors, automotive components
Tianjin
CNProduction
Goxin (Gaoxin)
CNProduction
Calamba, Laguna
PHProduction
Nakhon Ratchasima (SEMKORAT)
THProduction
Vietnam
VNProduction
Inside the production



Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| MLCC manufacturing (Multilayer Ceramic Capacitor, SMD chip components)Plastics | – | – | – | – | Ceramic (MLCC, C0G Cu/Ni type) |
| Silicon capacitor manufacturing (semiconductor capacitor)Plastics | – | – | – | – | Silicon |
| Tantalum capacitor manufacturingPlastics | – | – | – | – | Tantalum |
| Power inductor (coil) manufacturingPlastics | – | – | – | – | – |
| Chip resistor (SMD resistor) manufacturingPlastics | – | – | – | – | – |
| Package substrate (IC substrates, FOPLP, SoS System on Substrate) manufacturingPlastics | – | – | – | – | – |
| PCB / MLB (Multi Layer Board, rigid-flex printed circuit boards) manufacturingPlastics | – | – | – | – | – |
| Camera module manufacturing (including triple camera, folded zoom, weather-proof automotive)Assembly | – | – | – | – | Glass (lenses), Plastic (lenses) |
| Automotive components / electronic modules (e-mirror, surround view camera, automotive MLCC)Assembly | – | – | – | – | – |
| Assembly and packaging technologies for electronic components and modules (chip-on-board, SMDAssembly | – | – | – | – | – |
1 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Automated production systems / production lines (as early as 1979 for ceramic capacitors) | – | – | – | 1979 | Suwon |
Additional services
Reference customers
Quality
The sites are certified according to ISO 9001, IATF 16949, ISO 14001, ISO 45001, ISO 50001, ISO 22301 as well as information security standards (TISAX, ISO 27001, ISO 21434); the company has been listed on the DJSI continuously since 2009.
| Evidence | Suwon | Sejong | Busan |
|---|---|---|---|
| ISO 9001 | |||
| IATF 16949 | |||
| ISO 14001 | |||
| ISO 45001 | |||
| ISO 50001 | |||
| ISO 22301 | |||
| ISO 27001 | |||
| TISAX | |||
| ISO 21434 |