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Samtec – Fertigung

Manufacturer of connectors, high-speed cables, optical and RF interconnect solutions from Silicon-to-Silicon™.

Samtec Logo

Samtec, Inc.

New Albany, IN (HQ) · Scottsburg, IN · Wilsonville, OR · Colorado Springs, CO · Alajuela (CR) · Singapore · Huizhou (CN) · Johor Bahru (MY) · Penang (MY) · Dong Nai (VN) · New Taipei City (TW)New on Amplifa

1976Founded
40+Global locations
14+Global production facilities
70 GHzRF testing up to
112 Gbps PAM4High-speed performance

About Samtec

Founded in 1976, Samtec is a privately owned manufacturer of interconnect solutions headquartered in New Albany, Indiana (USA). The product portfolio includes high-speed board-to-board connectors, mezzanine and backplane systems, precision-extruded high-speed cables (Flyover®), mid-board optical transceivers, RF cables and connectors, as well as rugged power and flexible stacking systems with data rates up to 112 Gbps PAM4 and test frequencies up to 70 GHz. Vertical integration extends from high-precision stamping through plating, injection molding and automated assembly to IC packaging manufacturing (microelectronics) and signal/power integrity validation. Samtec serves industries such as Military & Aerospace, Automotive, Data Center/AI, Telecommunications, Medical Technology and Industrial. The company maintains more than 40 global locations, including over 14 production facilities in the USA, Costa Rica, Singapore, China, Malaysia, Taiwan and Vietnam; in Germany, Samtec is represented in Germering with a sales office.

Site
New Albany, IN
Processes
High-precision stamping, Plating, Injection molding, Automated assembly, Precision-extruded cables and assemblies (high-speed cable manufacturing), IC packaging design and manufacturing (Microelectronics), Micro-optical drivers and assemblies (R&D, design, development), RF interconnect design and development with testing up to 70 GHz
Materials
High-Precision Stamping, Plating, Injection Molding, Precision-Extruded Cables, IC Packaging / Microelectronics, Signal & Power Integrity Analysis
Certificates
ISO 9001, IATF 16949, ISO 14001, ISO 50001, CMMC Level 2
Founded
1976
Industries
Military & Aerospace, Automotive, Data Center / AI, Telecommunications, Medical Technology, Industrial
  1. 01

    Engineering & Design (Signal Integrity, Optics, RF)

  2. 02

    High-precision stamping

  3. 03

    Plating

  4. 04

    Injection molding

  5. 05

    Automated assembly

  6. 06

    Cable extrusion & assembly manufacturing

  7. 07

    Microelectronics / IC Packaging

  8. 08

    Testing & Validation

Manufacturing Processes & Technologies

STANZ

High-Precision Stamping

Manufacture of high-precision contact and sheet-metal parts for connectors at the Advanced Interconnects Technology Center.

GALV

Plating

Surface finishing of contacts, including gold and silver plating for high-speed applications.

SPG

Injection Molding

Injection molding of insulator and housing parts for connector families.

EXTR

Precision-Extruded Cables

In-house R&D and manufacturing of precision-extruded high-speed cables and assemblies (Flyover®).

ICP

IC Packaging / Microelectronics

Advanced IC packaging design, support and manufacturing for Silicon-to-Silicon™ solutions.

SI

Signal & Power Integrity Analysis

Full-channel SI/PI analysis, testing and validation services up to the RF range (70 GHz).

Solution Blocks & Products

High-Speed Board-to-Board
High-Speed Board-to-BoardConnectors · Data Center / AI
Optics
OpticsMid-board optical transceivers · Telecommunications
High-Speed Cable (Flyover®)
High-Speed Cable (Flyover®)Extrusion · Data Center / AI
RF Solutions
RF SolutionsRF cables & connectors · Military & Aerospace
Rugged / Power
Rugged / PowerRugged contact and power systems · Industrial
Flexible Stacking
Flexible StackingBoard-to-Board 0.80–5.08 mm Pitch · Electronics

Inside the production

Precision-manufactured connector contacts with gold/silver plating
Precision-manufactured connector contacts with gold/silver plating
High-Speed Board-to-Board Interconnects
High-Speed Board-to-Board Interconnects
Technology Centers: Integration Leads to Innovation
Technology Centers: Integration Leads to Innovation
Samtec's Global Locations
Samtec's Global Locations

Industries

Military & AerospaceAutomotiveData Center / AITelecommunicationsMedical TechnologyIndustrial

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
High-precision stampingForming–––––
PlatingSurface–––––
Injection moldingPlastics–––––
Automated assemblyAssembly–––––
Precision-extruded cables and assemblies (high-speed cable manufacturing)Plastics–––––
IC packaging design and manufacturing (Microelectronics)Engineering–––––
Micro-optical drivers and assemblies (R&D, design, development)Assembly–––––
RF interconnect design and development with testing up to 70 GHzTesting–––––
Signal and power integrity analysis, testing and validationTesting–––––

Additional services

Signal Integrity Group: SI/PI analysis, testing and validationOptics R&D, design and supportHigh-precision stamping, plating, injection molding, automated assemblyAdvanced IC Packaging (Microelectronics)In-house R&D and manufacturing of extruded high-speed cablesRF design and testing up to 70 GHzCustomer-specific products (Modified and Custom)Free product samplesOnline design tools (Solutionator®, Cable Builder, 3D Models)Upscreen testing for Mil/Aero

Reference customers

SpaceX (Supplier Appreciation Award 2020)Fujitsu (Supplier Appreciation Award 2020)Anritsu (Global Excellent Supplier Award 2023)Flex (Sustainability Award 2026)

Quality & Certifications

Samtec maintains quality management systems according to ISO 9001 and IATF 16949 at numerous plants; the testing scope includes, among others, ANSI/ASQ Z1.4 sampling, EIA-364-/MIL-STD-1344 procedures, upscreen testing for Mil/Aero and full-channel signal integrity validation.

EvidenceHuizhouCosta RicaPenangMalaysia (Johor)VietnamScottsburg
ISO 9001
IATF 16949
ISO 14001
ISO 50001

History

  1. 1976

    Samtec founded in the USA.

  2. 2001

    Establishment of the BlueSky Network (strategic investment and philanthropy partner).

  3. 2018

    Launch of the Samtec Cares Grant Program.

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