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Schambeck Elektronik – Fertigung

Contract assembly of printed circuit boards: SMD, THT, selective soldering, microplacer, cable assembly and repair

Schambeck Elektronik Logo

Schambeck Elektronik GmbH

Brennberg (Adeltal 18)New on Amplifa

2022First ISO 9001:2015 certification
1Location in Brennberg
32 layersMax. multilayer processed

About Schambeck Elektronik GmbH

Schambeck Elektronik GmbH is a mid-sized contract electronics manufacturer based in Brennberg near Regensburg. The company specializes in the assembly of printed circuit boards (PCBs): the focus is on SMD assembly with modern pick-and-place machines, complemented by conventional manual THT assembly, mixed assembly and selective soldering on the Cube.460 system for small to large volumes. With a high-precision microplacer, Flip-Chip, chip, BGA and Micro-BGA components of any size can be placed; multilayer PCBs of up to 32 layers are processed. The range of services also includes solder paste printing and stencil printing, dispensing, reflow soldering, press-fit technology, PCB cleaning, cable assembly, repair work including BGA rework, and material procurement. Production ranges from prototyping through pre-series to series production. Customers come from the automotive, healthcare, telecommunications, metrology, semiconductor and industrial electronics sectors. Since May 2022 the company has been certified to ISO 9001:2015.

Site
Brennberg
Processes
SMD assembly (pick-and-place machines), Manual THT assembly / mixed assembly, Selective soldering (THT components, small to large volumes), Microplacer assembly (Flip-Chip, chip, BGA, Micro-BGA), Cable assembly, Repair work / replacement of defective components (desoldering and replacing, BGA rework), Stencil printing / solder paste printing, Reflow soldering (reflow oven)
Materials
Printed circuit boards (PCBs), Multilayers (up to 32 layers), Solder paste (solder spheres in flux), Multilayer up to 32 layers, BGA / Micro-BGA and Flip-Chip components, Solder paste
Certificates
ISO 9001:2015, ISO 9001
Industries
Automotive, Healthcare, Telecommunications, Metrology, Semiconductor industry, Industrial electronics
  1. 01

    Material procurement

  2. 02

    Solder paste printing / dispensing

  3. 03

    SMD and THT assembly

  4. 04

    Reflow and selective soldering

  5. 05

    Cleaning

  6. 06

    Quality control

  7. 07

    Cable assembly / final assembly

Materials and Processes

PCB

Printed circuit boards (PCBs)

Base material of all assembly, soldering and repair processes.

ML-32

Multilayer up to 32 layers

Processing of multilayer PCBs with high packing density, also with press-fit technology.

BGA

BGA / Micro-BGA and Flip-Chip components

High-precision placement of the smallest and most sensitive components with the microplacer.

LOT

Solder paste

Solder spheres in flux, applied by stencil printer or semi-automatic machine as the basis of solder joints.

Locations

Standort Brennberg

Brennberg

DE

Manufacturing and administration

Lot size
Prototypes to large series
Materials
PCBs, multilayers up to 32 layers
  • SMD pick-and-place machines
  • Microplacer
  • Selective soldering system Cube.460
  • Reflow oven
  • Solder paste printer
  • Semi-automatic machine

Industries

AutomotiveHealthcareTelecommunicationsMetrologySemiconductor industryIndustrial electronics

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
SMD assembly (pick-and-place machines)Assembly–––Prototypes – large seriesPCBs
Manual THT assembly / mixed assemblyAssembly––––PCBs
Selective soldering (THT components, small to large volumes)Joining–––small volumes – large volumesPCBs
Microplacer assembly (Flip-Chip, chip, BGA, Micro-BGA)Assembly––––PCBs
Cable assemblyAssembly–––––
Repair work / replacement of defective components (desoldering and replacing, BGA rework)Assembly––––PCBs
Stencil printing / solder paste printingAssembly––––PCBs
Reflow soldering (reflow oven)Joining––––PCBs
Dispensing (solder paste applied point by point with semi-automatic machine)Assembly–––PrototypesPCBs
Press-fit technology (press-fit connection)Joining––––PCBs
Processing of multilayers up to 32 layersAssembly––––Multilayer PCBs
PCB cleaningSurface––––PCBs
Material procurement / component sourcingEngineering–––––

6 Anlagen & Maschinen

MachineManufacturer / modelQuantityWorking areaYear builtSite
Pick-and-place machine (SMD)––––Brennberg
Microplacer (high-precision placement)––––Brennberg
Selective soldering systemCube.460–––Brennberg
Reflow oven––––Brennberg
Solder paste printer––––Brennberg
Semi-automatic machine (manual solder paste application)––––Brennberg

Additional services

SMD assembly (pick-and-place machines)THT assembly (manual assembly, mixed assembly)Selective soldering (selective soldering system Cube.460)Microplacer assembly (Flip-Chip, chip, BGA, Micro-BGA)Cable assemblyRepair work (replacement of defective components, BGA rework)Material procurementPrototypingPre-series and series productionAssembly of components from cut tape (semi-automatic machine)Solder paste printing / stencil printingDispensingPCB cleaningPress-fit technologyProcessing of layout data formats Eagle, Target, KiCad, PDF

Quality

Since May 2022, Schambeck Elektronik GmbH has been certified to ISO 9001:2015 (certificate GM3341, QAS International GmbH); compliance is monitored through annual audits.

EvidenceBrennberg
ISO 9001

History

  1. 2022

    First certification to ISO 9001:2015 on 03 May 2022 (certificate GM3341, QAS International GmbH)

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