Power electronics: semiconductor devices, power modules, stacks and systems up to the multi-megawatt range
SEMIKRON DANFOSS GmbH
NurembergNew on Amplifa
About Semikron Danfoss
Semikron Danfoss is a global power electronics technology company and part of the Danfoss Group. The product portfolio includes semiconductor devices, power modules, power electronic stacks up to the multi-megawatt range as well as integrated systems (IPM) with gate drivers, sensor technology and liquid cooling. Manufacturing is based on interconnection and packaging technologies such as silver sintering, soldering, press-fit, wire bonding and thin wafer technology, with chipsets based on silicon (IGBT, CAL7 freewheeling diodes) and SiC (2kV SiC MOSFETs) as well as copper substrates and terminals. The module portfolio ranges from MiniSKiiP and SEMiX 3p+ via SEMITRANS 3+ to the new high-power module SEMITRANS 20, which is approved for series production. Fields of application include data centers (UPS, drives), wind and solar energy, energy storage, drive technology, rail traction, green hydrogen, UPS systems and automotive. In addition, the company offers engineering for converter topologies (2-/3-level, TNPC, ANPC, SST), reliability testing as well as digital services such as SemiSel simulation, the online shop and the Application Manual Power Semiconductors.
- Site
- Nuremberg
- Processes
- Power module manufacturing (power module packaging), Silver sintering (chip attachment, sinter technology), Soldering (welded/soldered power terminals; press-fit as solder-free alternative for auxiliary, Thin wafer technology for CAL7 diodes, chips also as bare die, Power electronic stacks up to the multi-megawatt range, IPM system integration with integrated gate driver, current/voltage sensors and, SemiSeal encapsulation/protective layer against corrosive gases (H2S) in power modules, Wire bonding (high performance wire bond materials)
- Materials
- SiC (silicon carbide) MOSFETs, 2kV, Silicon (IGBT chips), IGBT chips from CRRC (1200V, 1700V, 2300V), CAL7 freewheeling diodes (1200V, 1700V), Silver (sinter material), Copper (traces, terminals, substrate/baseplate materials), SiC MOSFETs (2kV), CAL7 freewheeling diode
- Certificates
- Reliability testing / power cycling, LCA according to ISO 14040/14044
- Industries
- Data centers, Wind energy, Solar energy, Energy storage systems (ESS), Drive technology, Rail traction
- 01
Chip and substrate manufacturing (silicon, SiC, thin wafer)
- 02
Chip attachment (silver sintering, soldering)
- 03
Wire bonding and high-current terminals (soldering/press-fit)
- 04
Module integration with gate driver, sensor technology and cooling (IPM)
- 05
SemiSeal protective coating
- 06
System integration into stacks up to multi-megawatt
- 07
Reliability testing and qualification
Materials & Processes
SiC MOSFETs (2kV)
Silicon carbide MOSFETs up to 2kV for 1500V DC architectures in solar, ESS, green hydrogen and DC distribution.
Silicon (IGBT chips)
IGBT chips from multiple sources (including CRRC with 1200V, 1700V, 2300V) up to 175°C junction temperature.
CAL7 freewheeling diode
CAL diodes in thin wafer technology (1200V, 1700V) with soft switching behavior and higher power cycling capability; also available as bare die.
Silver sintering
Chip attachment by means of silver sintering for high thermal and electromechanical reliability in SKiiP 4 SiC modules.
Copper
Copper for terminals, traces as well as substrate and baseplate materials; SemiSeal protects Cu surfaces against H2S corrosion.
Press-fit technology
Solder-free press-fit connections for driver connectivity, e.g. in the SEMiX 3p+ platform.
Wire bonding
High-performance bond materials for chip interconnections in power modules such as SEMITRANS 20.
SemiSeal protective layer
Protective layer inside the module against dendrite formation caused by corrosive gases (H2S) and additional moisture robustness.
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Power module manufacturing (power module packaging)Assembly | – | – | – | – | SiC (silicon carbide), Silicon (IGBT/diode chips), Copper |
| Silver sintering (chip attachment, sinter technology)Joining | – | – | – | – | SiC (silicon carbide), Silicon |
| Soldering (welded/soldered power terminals; press-fit as solder-free alternative for auxiliaryJoining | – | – | – | – | Copper, SiC (silicon carbide), Silicon (IGBT) |
| Thin wafer technology for CAL7 diodes, chips also as bare dieSemiconductor manufacturing | – | – | – | – | Silicon |
| Power electronic stacks up to the multi-megawatt rangeAssembly | – | – | – | – | SiC (silicon carbide), Silicon (IGBT) |
| IPM system integration with integrated gate driver, current/voltage sensors andAssembly | – | – | – | – | SiC (silicon carbide) |
| SemiSeal encapsulation/protective layer against corrosive gases (H2S) in power modulesSurface | – | – | – | – | Copper (protection of Cu surfaces) |
| Wire bonding (high performance wire bond materials)Joining | – | – | – | – | Copper, Silicon |
| Reliability testing (power cycling, LCA according to ISO 14040/14044)Testing | – | – | – | – | – |
| Engineering/system design for converters (2-/3-level topologies, TNPC, ANPC, SST, 1500V DC)Engineering | – | – | – | – | – |
Additional services
Quality & Reliability
Reliability is safeguarded through power cycling and reliability testing as well as LCA according to ISO 14040/14044; SemiSeal and moisture robustness increase lifetime in harsh environments.
| Evidence | Nuremberg |
|---|---|
| Reliability testing / power cycling | |
| LCA according to ISO 14040/14044 |
History
New plant in Nanjing (China) for local-for-local production
SEMITRANS 20 approved for series production