Develops and manufactures optical wafer metrology systems (SemDex) for semiconductor manufacturing from Wafer Manufacturing to Advanced Packaging.
sentronics metrology GmbH
68167 MannheimNew on Amplifa
About sentronics metrology
sentronics metrology GmbH, based in Mannheim, is a provider of optical metrology solutions for the semiconductor industry. The company develops and manufactures the SemDex metrology systems, which are used to inspect wafers non-contact for bow, warp and flatness, layer thicknesses, thin films, roughness, TSV depths as well as 2D and 3D critical dimensions – from Wafer Manufacturing through FEOL and BEOL to Wafer Level Packaging. The metrology is based on optical interferometry, reflectometry and interference microscopy and delivers quality results to the FAB host via SECS/GEM. The cabinet-sized, fully automated systems weighing around one tonne are assembled in the Mannheim production hall, inspected in a cleanroom environment and delivered to chip manufacturers worldwide, primarily in the USA and Asia. Since 2025, the company founded in 2006 with more than 120 employees has been part of the publicly listed group Nova Ltd. (Israel).
- Site
- Mannheim
- Processes
- Wafer Metrology (Bow/Warp/Flatness), Multilayer Thickness / Layer Thickness Si, Thin Film Thickness (Passivation/Photoresist), Roughness Measurement, 2D/3D Critical Dimensions (UBM, Shell Elements, Wafer Level Packaging), TSV Depth / 3D Trench Metrology, Remaining Silicon Thickness, Bonding Thickness
- Materials
- Silicon wafer, Photoresist, Passivation layer (thin film), Spectral Coherence Interferometry, Interference Microscopy, Reflectometry, Silicon Wafer, Thin Films (Passivation, Photoresist)
- Certificates
- ISO 9001 (TÜV Süd, verifiable via the company website)
- Founded
- 2006
- Employees
- 120+
- Industries
- Semiconductor industry, Wafer Manufacturing, FEOL, BEOL, Wafer Level Packaging, Advanced Packaging
- 01
Development of custom metrology solutions
- 02
Assembly of the metrology systems in the Mannheim production hall
- 03
Inspection and testing in a cleanroom environment (approx. 1 week incl.
- 04
Packaging (approx. 1 working day per unit)
- 05
Worldwide delivery (among others via Frankfurt Airport)
- 06
On-site service and maintenance at the customer
Metrology Technologies and Applications
Spectral Coherence Interferometry
Optical measurement of single and multilayer film thicknesses as well as wafer shape.
Interference Microscopy
3D topography measurement of wafer structures.
Reflectometry
Optical thin-film measurement, e.g. on passivation or photoresist layers.
Silicon Wafer
Measurement objects of wafer metrology across all process steps.
Thin Films (Passivation, Photoresist)
Layer thickness determination at wafer level.
Site
Mannheim
DEHeadquarters, production, development
- Part weight / size
- approx. 1 tonne per unit (measurement module approx. 700 kg)
- Lot size
- Individual units (small series)
- Materials
- Silicon wafers as measurement objects
- SemDex A
- SemDex M2
- SemDex M1
- Nova SemDex (3D Trench TSV Metrology)
- Cleanroom test area
Products
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Wafer Metrology (Bow/Warp/Flatness)Inspection | – | – | – | – | Silicon wafers |
| Multilayer Thickness / Layer Thickness SiInspection | – | – | – | – | Silicon |
| Thin Film Thickness (Passivation/Photoresist)Inspection | – | – | – | – | Silicon wafers |
| Roughness MeasurementInspection | – | – | – | – | Silicon wafers |
| 2D/3D Critical Dimensions (UBM, Shell Elements, Wafer Level Packaging)Inspection | – | – | – | – | Silicon wafers |
| TSV Depth / 3D Trench MetrologyInspection | – | – | – | – | Silicon wafers |
| Remaining Silicon ThicknessInspection | – | – | – | – | Silicon |
| Bonding ThicknessInspection | – | – | – | – | Silicon wafers |
| Laser Groove MeasurementInspection | – | – | – | – | Silicon wafers |
| Spectral Coherence Interferometry (optical film thickness and wafer shape measurement)Inspection | – | – | – | – | Silicon |
| Interference Microscopy (3D topography)Inspection | – | – | – | – | Silicon wafers |
| Reflectometry (thin-film measurement)Inspection | – | – | – | – | Silicon wafers |
| Assembly/Commissioning of metrology systems incl. inspection and testing in a cleanroom environmentAssembly | – | – | approx. 1 tonne per unit | – | – |
| Engineering | – | – | – | – | – |
5 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Wafer metrology system (semi-/fully automated) | sentronics metrology SemDex A | – | – | – | Mannheim |
| Wafer metrology system | sentronics metrology SemDex M2 | – | – | – | Mannheim |
| Wafer metrology system | sentronics metrology SemDex M1 | – | – | – | Mannheim |
| 3D Trench TSV Metrology System (best seller) | sentronics metrology Nova SemDex | – | – | – | Mannheim |
| Fully automated high-precision measuring system (cabinet-sized, ca. 1 t, measurement module ca. 700 | sentronics metrology / Nova Nova SemDex | – | – | – | Mannheim |
Additional services
Reference customers
Quality
Every metrology system is inspected, tested and documented in a cleanroom environment for around one week after assembly before being shipped. Trained service teams ensure quality worldwide on-site at customers and replace components during ongoing operation.
| Evidence | Mannheim |
|---|---|
| ISO 9001 (TÜV Süd, verifiable via the company website) |
History
- 2006
Founded as sentronics metrology.
- 2024
Acquisition by the publicly listed group Nova Ltd. (Israel) announced; Gleiss Lutz advises Nova.
- 2025
Nova completes the acquisition; sentronics metrology becomes part of the Nova Group.