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Signal-Construct – Fertigung

Development and manufacturing of LED lamps, signal lights, LED modules and custom LED solutions

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Signal-Construct elektro-optische Anzeigen und Systeme GmbH

Niefern-Oeschelbronn (DE)New on Amplifa

around 50Employees
over 40 yearsMarket presence
6Injection molding machines
up to 80 gInjection molded part weight
-70 °C to +120 °CClimate test range

About Signal-Construct

Signal-Construct elektro-optische Anzeigen und Systeme GmbH is a medium-sized company with around 50 employees that develops and manufactures LED-based product solutions for a wide variety of industries. The product range extends from LED lamps and signal and indicator lights to status indicators, light guides, jumbo LEDs and LED spots through to custom LED solutions for applications in buses, trains, aircraft and ships as well as in the electrical and electronics industry, water and road engineering, and avionics. Manufacturing covers LED processing and LED taping, SMD/THT printed circuit board assembly with reflow, vapor-phase, robotic, laser and induction soldering, in-house plastic parts production on six injection molding machines, ultrasonic and spot welding, crimping, and 2- and 3-component potting technology based on PU and epoxy. Tool design and toolmaking are carried out in-house; prototypes and pilot series are realized using 3D printing and plotter technology. The in-house measuring laboratory offers a goniometer, spectrometer, optical bench and integrating sphere for light measurement as well as temperature and climate tests from -70 °C to +120 °C. Production takes place at the Niefern-Oeschelbronn site in Baden-Württemberg; manufacturing is certified to DIN EN ISO.

Site
Niefern-Oeschelbronn
Processes
LED processing and LED taping (bending to customer drawing, cutting pins to size, THT LEDs as, Printed circuit board assembly SMD/THT (dispensing, mixed assembly, reflow and vapor-phase, Soldering: iron soldering with soldering robot, light/laser soldering, induction soldering, Plastic parts production (injection molding), Ultrasonic joining technology / ultrasonic welding, Potting / potting technology (2- and 3-component based on PU and epoxy), Spot welding, Crimping
Materials
Aluminium (natural anodized), Acrylic glass (PMMA), Polyurethane (PU), Epoxy, Plastic (housing/insulating parts, optics), Metal (housing), Copper wire (UL-Style 1061 AWG24), Plastic (insulating and housing parts, optics)
Certificates
DIN EN ISO 9001
Employees
around 50
Industries
Electrical and electronics industry, Water, Road, Rail, Avionics, Bus/rail/aircraft/ship (mobility)
  1. 01

    Product development and design

  2. 02

    Tool design and toolmaking

  3. 03

    Plastic parts production (injection molding)

  4. 04

    LED processing and LED taping

  5. 05

    Printed circuit board assembly SMD/THT and soldering

  6. 06

    Joining technology (ultrasonic, spot welding, crimping, potting)

  7. 07

    Laser marking

  8. 08

    Pre- and final assembly

  9. 09

    Light measurement and testing

Materials & Processes

Al

Aluminium (natural anodized)

Housing material for LED spots and modules, e.g. for the Power-LED module MinoStar IP67.

PMMA

Acrylic glass (PMMA)

Material for optics and lenses in LED lighting products.

PU

Polyurethane (PU)

PU-based potting compounds for 2- and 3-component mixes, also for optical applications.

EP

Epoxy

Epoxy-based potting compounds for 2- and 3-component mixes, also for optical applications.

Kunststoff

Plastic (insulating and housing parts, optics)

Injection-molded insulating parts, housings and optical components up to 80 g part weight.

Cu

Copper wire (UL-Style 1061 AWG24)

Connection leads for LED modules, e.g. 0.22 mm² with 50 cm length.

Sites

Standort Niefern-Oeschelbronn

Niefern-Oeschelbronn

DE

Headquarters and production

Part weight / size
Injection molded parts up to 80 g
Lot size
Prototypes to large-scale series
Materials
Plastic, aluminium, PMMA, PU, epoxy
  • 6 injection molding machines
  • Reflow and vapor-phase soldering systems
  • Soldering robots for THT components
  • Laser and induction soldering systems
  • Ultrasonic welding machines
  • Spot welding machine
  • Crimping machines
  • Potting systems (2-/3-component PU/epoxy)
  • 2 laser marking systems
  • Assembling and placement systems
  • Goniometer, spectrometer, optical bench, integrating sphere
  • Temperature and climate chambers -70 °C to +120 °C
  • 3D printing system and plotter technology
  • Dispensers for solder paste application

Components

Single LED lamp Ø 5.6 mm, BA5s base
Single LED lamp Ø 5.6 mm, BA5s baseLED lamp manufacturing · Mobility
Single LED lamp Ø 9.8 mm, BA9s base
Single LED lamp Ø 9.8 mm, BA9s baseLED lamp manufacturing · Mobility
Reflector LED spot with glass lens, BA9s base
Reflector LED spot with glass lens, BA9s baseLED spot manufacturing · Signal lights
Vehicle light
Vehicle lightLED processing · Bus/rail/ship
SicoFix LED light strips
SicoFix LED light stripsModular system · Object and general lighting
Power-LED module MinoStar IP67
Power-LED module MinoStar IP67Injection molding/potting · Outdoor lighting
Infrared modules and components
Infrared modules and componentsLED processing · Electronics industry
RGB ring light
RGB ring lightLED processing · HMI/status display

Inside the production

Potting technology
Potting technology
Development and design
Development and design
Signal-Construct product catalog
Signal-Construct product catalog
Light guides for front panel mounting
Light guides for front panel mounting
Spacers for 3-pin LEDs
Spacers for 3-pin LEDs

Industries

Electrical and electronics industryWaterRoadRailAvionicsBus/rail/aircraft/ship (mobility)Building/residential lighting

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
LED processing and LED taping (bending to customer drawing, cutting pins to size, THT LEDs asAssembly––––LEDs (wired, IR components)
Printed circuit board assembly SMD/THT (dispensing, mixed assembly, reflow and vapor-phaseAssembly––––Printed circuit boards, SMD components, THT components
Soldering: iron soldering with soldering robot, light/laser soldering, induction solderingJoining––––Printed circuit boards, THT LEDs, IR diodes
Plastic parts production (injection molding)Plastics––80 g–Plastics (insulating and housing parts, optics, lenses)
Ultrasonic joining technology / ultrasonic weldingJoining––––Plastics
Potting / potting technology (2- and 3-component based on PU and epoxy)Joining––––Polyurethane (PU), Epoxy
Spot weldingJoining––––Wires, Stranded wires, Cables
CrimpingJoining––––Wires, Stranded wires, Lines
Assembly of stranded wires and cablesAssembly––––Stranded wires, Cables
Laser markingSurface–––––
Tool design and toolmakingEngineering–––––
Prototype production using 3D printing and plotter technologyAdditive––––Plastic, Printed circuit boards
Light measurement (goniometer, spectrometer, optical bench, integrating sphere)Testing–––––
Temperature and climate tests -70°C to +120°CTesting–––––
Pre- and final assembly (automatic/semi-automated)Assembly–––––
Product development and design of custom LED solutionsEngineering–––––

20 Anlagen & Maschinen

MachineManufacturer / modelQuantityWorking areaYear builtSite
Injection molding machines–6––Niefern-Oeschelbronn
Reflow soldering system––––Niefern-Oeschelbronn
Vapor-phase soldering system––––Niefern-Oeschelbronn
Soldering robot (iron soldering, THT)––––Niefern-Oeschelbronn
Laser soldering system––––Niefern-Oeschelbronn
Induction soldering system––––Niefern-Oeschelbronn
Ultrasonic welding machine––––Niefern-Oeschelbronn
Spot welding machine––––Niefern-Oeschelbronn
Crimping machine––––Niefern-Oeschelbronn
Potting system (2-/3-component PU/epoxy)––––Niefern-Oeschelbronn
Laser marking system–2––Niefern-Oeschelbronn
Assembling/placement systems––––Niefern-Oeschelbronn
Goniometer (light measurement)––––Niefern-Oeschelbronn
Spectrometer––––Niefern-Oeschelbronn
Integrating sphere––––Niefern-Oeschelbronn
Optical bench––––Niefern-Oeschelbronn
Temperature and climate chambers (-70°C to +120°C)––––Niefern-Oeschelbronn
3D printing system––––Niefern-Oeschelbronn
Plotter technology––––Niefern-Oeschelbronn
Dispenser (solder paste application)––––Niefern-Oeschelbronn

Additional services

Custom LED solutions / product developmentPrototype and pilot series production (3D printing, plotter technology)LED processing and LED tapingPrinted circuit board assembly SMD/THT (reflow, vapor phase, soldering robots, laser/inductionPlastic parts production (injection molding)Light measurement (goniometer, spectrometer, integrating sphere)Temperature/climate tests -70°C to +120°CPre- and final assemblyPotting technology (2-component)Tool design and toolmaking

Quality

Manufacturing is certified to DIN EN ISO. Inline testing of current, voltage and light color during LED processing as well as an in-house measuring laboratory with goniometer, spectrometer, optical bench and integrating sphere guarantee compliance with product requirements.

EvidenceNiefern-Oeschelbronn
DIN EN ISO 9001

History

  1. Active for over 40 years in the development and production of LED-based products; numerous products have become market standards.

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