Equipment, spare parts and own brands for wafer handling, photolithography, wet processes and CMP in semiconductor manufacturing.
SPS Europe B.V.
Putten (NL) · Ingolstadt · Hamburg · Dresden · Vaulx-Milieu (FR) · Milan (IT) · Singapore · Boston (USA) · Damascus, Oregon (USA) · Liverpool (UK) · Tokyo (JP)New on Amplifa
About SPS
SPS (Semiconductor Production Systems) is an internationally active supplier of products and systems for semiconductor manufacturing. The portfolio includes wafer handling (vacuum wands, wafer sorters, wafer aligners), wafer shipping (shippers, FOSB, FOUP, moisture barrier bags), process cassettes made of PP, PTFE, PFA and PEEK, wet process equipment for cleaning and etching including megasonic cleaning, polishing and CMP components, photolithography equipment, and fluid handling with heaters, filters, pumps and valves. Own product brands are POLOS (spin coaters, maskless lithography systems, ALD systems), esPRO (fluid handling, inline heaters, process baths) and WHS (Wafer Handling Systems). In addition, SPS offers spare parts, tool refurbishment including robot refurbishment and Semitool upgrades, CMP process training and custom solutions; over 9,000 parts are available from stock. The company can look back on more than 35 years of experience in the semiconductor industry and, through locations in Europe, the USA and Asia, serves not only the semiconductor and microelectronics industries but also life science as well as laboratory and pharmaceutical applications.
- Site
- TS Putten
- Processes
- Spin Coating / Spin Processors (POLOS SPINx-Series), Spray Coating (Ultrasonic, POLOS UC320/UC330/UC360c), Maskless Lithography / Direct Laser Writing (Print UV, Beam, Beam XL, NanoWriter), Mask Aligner (manual, semi-automatic, automatic; MDA-400LJ, MDA-400M, MDA-80MS, MDA-12FA), Atomic Layer Deposition (Thermal & Plasma ALD, AT200/AT410/AT650P/AT650T), Wet Process: Cleaning, Etching, Spin Process Stations, Immersion Baths, Megasonic Cleaning, CMP (Chemical Mechanical Polishing): Polishing, Pad Conditioners, Polishing Pads, Slurry Accessories, Polishing Service (Mipox): Edge Polishing, Cleaning, Permanent Bonding, Surface Polishing, Wafers
- Materials
- Polypropylene (PP), PTFE, PFA, PEEK, PVDF, Aluminium, Stainless steel, Quartz
- Certificates
- ISO disclaimer mentioned (ISO certification of SPS Group BV, SPS Europe BV and, ISO certification (according to company disclaimer)
- Industries
- Semiconductor industry, Microelectronics, Life Science, Laboratory/Pharma (POLOS)
- 01
Technical consulting and product selection
- 02
Development of configurable products and custom solutions (POLOS, esPRO, WHS)
- 03
Delivery from stock (over 9,000 parts)
- 04
Tool refurbishment, maintenance and spare parts supply
- 05
CMP process training and technical support
Materials & Processes
Polypropylene (PP)
Material for process cassettes and process baths in the cleanroom.
PTFE
Chemically resistant material for cassettes, containers and wafer dippers.
PFA
Piping, fittings, pressure and storage vessels for fluid handling in wet processes.
PEEK
High-grade plastic for process cassettes.
PVDF
Material for process tanks in wet process cleaning and etching.
LDPE
Bag material for packaging and shipping.
Aluminium
Metal cassettes and test wafers for handling and transport.
Stainless steel
Metal cassettes, gas filters and process components.
Quartz
Process baths and wafer boats for wet processes.
Silicon wafer
Substrates for spin coating, lithography and wafer handling.
Glass
Substrate material for photolithography and spin processes.
Components & Products
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Spin Coating / Spin Processors (POLOS SPINx-Series)Plastics | – | 450 mm substrate diameter | – | – | Silicon wafer, Glass, Metal, Plastic |
| Spray Coating (Ultrasonic, POLOS UC320/UC330/UC360c)Plastics | – | – | – | – | Photoresist |
| Maskless Lithography / Direct Laser Writing (Print UV, Beam, Beam XL, NanoWriter)Engineering | Alignment accuracy 0.1–2 µm | 150 x 150 mm substrate | – | – | Silicon, Glass, Metal, Plastic, Photoresist |
| Mask Aligner (manual, semi-automatic, automatic; MDA-400LJ, MDA-400M, MDA-80MS, MDA-12FA)Engineering | – | – | – | – | Photoresist |
| Atomic Layer Deposition (Thermal & Plasma ALD, AT200/AT410/AT650P/AT650T)Surface | – | – | – | – | – |
| Wet Process: Cleaning, Etching, Spin Process Stations, Immersion Baths, Megasonic CleaningSurface | – | – | – | – | – |
| CMP (Chemical Mechanical Polishing): Polishing, Pad Conditioners, Polishing Pads, Slurry AccessoriesSurface | – | 450 mm (Polishing service Mipox) | – | – | – |
| Polishing Service (Mipox): Edge Polishing, Cleaning, Permanent Bonding, Surface Polishing, WafersSurface | – | 450 mm | – | – | Wafers |
| Wafer Handling: Manual/Automatic Wafer Transfers, Wafer Sorters, Wafer Aligners, Vacuum WandsAssembly | – | – | – | – | – |
| Wafer Shipping: Shippers, FOSB, FOUP, Moisture Barrier Bags, Vacuum SealerAssembly | – | 1000 mm (Vacuum Sealer) × 380 x 420 mm (Moisture Barrier Bag) | – | – | Aluminium, Stainless steel, PP, PTFE, PFA, PEEK |
| Grinding & Dicing Accessories: Film Frames, Dicing Tape, Die Matrix Expanders, UV CuringAssembly | – | – | – | – | – |
| Tool Refurbishment: Robot Refurbishment, Semitool Upgrades, Spray Acid/Solvent Tool, SpinAssembly | – | – | – | – | – |
| Film Thickness Measurement / Film Characterization (Fr-Scanner, Fr-ES, Fr-Pro, Fr-Mic)Testing | – | – | – | – | – |
| CMP Process Training (10 Modules)Engineering | – | – | – | – | – |
| Fluid Handling: Heaters, Filtration, Flow Measurement, Pumps, ValvesSurface | – | – | – | – | PFA, PTFE, Stainless steel |
| Ozone Generation (AT-Ozone Generator)Surface | – | – | – | – | – |
14 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Spin Coater | POLOS (SPS) SPIN150x Standard | – | 150 mm (up to 6"), up to 4" x 4" (100 mm), 1–30,000 RPM | – | – |
| Spin Coater | POLOS (SPS) SPIN150x / SPIN200x / SPIN300x / SPIN450x | – | max. substrate 150/200/300/450 mm round or 4x4/6x6/8x8/10x10 inches square | – | – |
| Spin Coater (automated) | POLOS (SPS) SPIN4000A / SPIN5000A | – | – | – | – |
| Maskless Lithography System | POLOS (SPS) POLOS BEAM XL Mk2 | – | 150 x 150 mm, tabletop | – | – |
| Maskless Lithography System | POLOS (SPS) Print UV Standard / BEAM / NanoWriter / NanoWriter Advanced | – | Exposure area 70x70 to 155x155 mm; resolution 0.3–1.5 µm | – | – |
| Mask Aligner | Midas / POLOS (SPS) MDA-400LJ / MDA-400M / MDA-400M-6 / MDA-600S / MA-400X / MDA-80MS / MDA-12FA | – | – | – | – |
| Atomic Layer Deposition System | POLOS (SPS) AT200 / AT410 / AT650P / AT650T | – | – | – | – |
| Inline Heater | ESPRO (SPS) ESPRO-LH | – | 180 °C | – | – |
| Ultrasonic Spray Coater | POLOS (SPS) UC330 / UC320 / UC360c | – | – | – | – |
| Hotplate | POLOS (SPS) Hotplate 200 / Hotplate 350 | – | – | – | – |
| Wafer Sorter (2-Cassette) | WHS (SPS) WHS-T4 with OCR | – | – | – | – |
| Megasonic Cleaning System | ESPRO (SPS) Batch/Shower/Cover type | – | – | – | – |
| Spray Acid Tool / Spray Solvent Tool / Spin Rinser Dryer (Refurbishment) | Semitool / ESPRO (SPS) | – | – | – | – |
| Film Thickness Measurement Device | POLOS (SPS) Fr-Scanner-AIO-Mic-XY200 / Fr-ES / Fr-Pro / Fr-Mic | – | – | – | – |
Additional services
Quality
SPS publishes a Quality Policy as well as a Quality & Environmental Policy and, via a disclaimer, points to an ISO certification of SPS Group BV, SPS Europe BV and SPS Europe GmbH. Products such as Moisture Barrier Bags are specified according to standards such as ANSI/ESD STM11.11 and cleanroom classes (ISO 3 / Class 1 FS209E).
| Evidence | Company |
|---|---|
| ISO certification (according to company disclaimer) |
History
Over 35 years of experience in the semiconductor industry (year of foundation not specified)