Service company for PCB assembly, soldering processes, PCB cleaning and the assembly of electronic modules.
SUB-DATA
Wurmsham-Pauluszell (84189) · Kirchheim b. Munich (place of founding)New on Amplifa
About SUB-DATA
SUB-DATA is an electrical engineering service company founded in 1989 in Kirchheim near Munich, headquartered in Wurmsham-Pauluszell (district of Landshut). The owner-managed company manufactures electronic modules on contract: services include through-hole technology (THT) PCB assembly, SMD and mixed assembly, machine-based PCB cleaning and the mounting of boards into housings. In addition, SUB-DATA handles the procurement of assembly materials including hard-to-source components. Production covers everything from prototypes to small and medium-sized series; samples are quickly realized at manual assembly stations. Approx. 600 m² of production space equipped in accordance with EGB guidelines is available, featuring SMD placement machines with vision systems, a vapor phase soldering system, a wave soldering system and a computer-controlled reflow soldering system. SMD package types from 0201 to fine pitch with 0.3 mm spacing, BGAs, special package types as well as double-sided assembly with a glue unit are covered; lead-free soldering is also offered.
- Site
- Wurmsham - Pauluszell
- Processes
- Through-hole PCB assembly (THT), SMD PCB assembly (incl. mixed assembly), Double-sided SMD assembly (with glue unit), Manual assembly / sample production, Vapor phase soldering, Wave soldering (lead-free), Reflow soldering (computer-controlled), Stencil printing (solder paste printing, semi-automatic)
- Materials
- SMD components 0201 to fine pitch (0.3 mm spacing), BGA, PCBs / modules, Lead-free solder, BGA and special package types, Through-hole components
- Certificates
- Vision inspection (placement machines), ISO 9001
- Founded
- 1989
- Industries
- Electrical engineering / Electronics
- 01
Component procurement / material provision
- 02
Stencil printing (solder paste)
- 03
SMD and manual assembly
- 04
Soldering (reflow, wave soldering, vapor phase soldering)
- 05
PCB cleaning
- 06
Mounting into housings
- 07
Quality control
Materials & Processes
SMD components 0201 to fine pitch (0.3 mm spacing)
Precise processing on SMD placement machines with vision systems.
BGA and special package types
Assembly of ball grid arrays and special package types including double-sided assembly with a glue unit.
Lead-free solder
Lead-free soldering on the SEHO Go Wave 1030 wave soldering system.
Through-hole components
Conventional assembly of through-hole components from prototype to medium series.
Sites
Wurmsham-Pauluszell
DEProduction building (since 1997)
- Lot size
- Prototype to medium series
- Materials
- SMD 0201 to fine pitch, BGA, through-hole components, lead-free solder
- SMD placement machine with vision system
- ASSCON vapor phase soldering system VP800
- SEHO wave soldering system Go Wave 1030
- Semi-automatic stencil printer
- Computer-controlled reflow soldering system
- IMO cleaning system ÖKO 2000
- Manual assembly stations
Components & Assemblies
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Through-hole PCB assembly (THT)Assembly | – | – | Medium series | Prototype – Medium series | PCBs, through-hole components |
| SMD PCB assembly (incl. mixed assembly)Assembly | – | – | – | Prototype – Medium series | SMD components 0201 to fine pitch (0.3 mm spacing), BGAs, Special package types |
| Double-sided SMD assembly (with glue unit)Assembly | – | – | – | – | SMD components |
| Manual assembly / sample productionAssembly | – | – | – | Samples – Small series | – |
| Vapor phase solderingJoining | – | – | – | – | PCBs, solder (lead-free possible) |
| Wave soldering (lead-free)Joining | – | – | – | – | PCBs, lead-free solder |
| Reflow soldering (computer-controlled)Joining | – | – | – | – | PCBs, solder paste |
| Stencil printing (solder paste printing, semi-automatic)Joining | – | – | – | – | solder paste |
| PCB cleaning (machine-based)Surface | – | – | – | – | modules, PCBs |
| Mounting of boards into housingsAssembly | – | – | – | – | boards, housings |
| Component distribution / material procurementEngineering | – | – | – | – | electronic components |
| Quality controlTesting | – | – | – | – | – |
7 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMD placement machine with vision system | – | – | – | – | Pauluszell |
| Vapor phase soldering system | ASSCON VP800 | – | – | – | Pauluszell |
| Wave soldering system | SEHO Go Wave 1030 | – | – | – | Pauluszell |
| Semi-automatic stencil printer | – | – | – | – | Pauluszell |
| Reflow soldering system (computer-controlled) | – | – | – | – | Pauluszell |
| PCB cleaning system | IMO ÖKO 2000 | – | – | – | Pauluszell |
| Manual assembly stations | – | – | – | – | Pauluszell |
Additional services
Quality
Quality control with the aim of producing high-quality and defect-free products; SMD placement machines with vision systems ensure precise processing.
| Evidence | Wurmsham-Pauluszell |
|---|---|
| Vision inspection (placement machines) | |
| ISO 9001 |
History
- 1989
Foundation of SUB-DATA in Kirchheim b. Munich
- 1997
Relocation to the newly built production facility in Pauluszell