Development and manufacturing of flexible flat conductor connections, jumpers and custom connection modules for the electronics industry.
SUMIDA flexible connections GmbH
Radeberg (HQ) · Jimbolia (RO) · Shanghai (CN) · Chicago (US)New on Amplifa
About SUMIDA flexible connections
SUMIDA flexible connections GmbH, based in Radeberg (Saxony), has been active as a manufacturer of flexible board connectors and sensors since 1993 and has been part of the globally positioned SUMIDA Corporation since 2006. The core portfolio comprises Flexible Board Connections (FBC), Flexible Flat Cables (FFC) and Flexible Modules, including complete assemblies from a single source. The core technology is the continuous lamination of copper conductors between adhesive-coated films; in addition, copper wires are flat-rolled, crimp contacts are attached at 1.27 mm and 2.54 mm pitch, cable ends are overmolded, encapsulated with hotmelt, back-adhesive bonded, laser-processed, and SMD and THT assemblies are produced with reflow and selective soldering. Around 350 employees at four locations (Radeberg, Jimbolia/Romania, Shanghai/China, Chicago/USA) serve industries such as automotive and e-mobility, industrial automation, robotics, medical technology, white goods, lighting and battery systems. Development ranges from the CAD model through prototypes to series production, accompanied by FMEA, simulation and in-house laboratory metrology. Products are designed for continuous operation at temperature ranges from -40 °C to +125 °C and up to 10 million flex cycles.
- Site
- Radeberg
- Processes
- Continuous laminating (copper conductors between films, pressure and temperature), Flat rolling of copper wires, Longitudinal and transverse cutting (singulation of laminated flat band), Stripping (special blades, connection ends), Crimping technology (crimping at 1.27 mm and 2.54 mm pitch), Overmolding (sliding-table injection molding machines), Encapsulation with hotmelt, Back-adhesive bonding (adhesive tapes and reinforcements)
- Materials
- Copper (copper wires, conductor cores), Aluminium (conductor cores), FR4 PCB material, Hotmelt (adhesive system), Adhesive-coated films (top/bottom film), Copper, Aluminium, Hotmelt
- Certificates
- ISO 9001, IATF 16949, ISO 14001, ISO 50001
- Founded
- 1993
- Employees
- 350
- Industries
- Automotive & E-Mobility, Industrial Automation, Robotics, Medical Technology & Sensor Technology, White Goods, Lighting/LED
Materials & Processes
Copper
Conductor cores and copper wires are laminated, flat-rolled and processed into flat conductors.
Aluminium
Conductor cores, e.g. as a hybrid Cu/Al combination in a flat band cable for LED connection systems.
FR4 PCB material
Standard material for board connections and SMD assembly, reduces unit costs.
Hotmelt
Solvent-free adhesive system for encapsulating cable ends and filigree components.
Adhesive-coated films
Top and bottom films for laminating the copper conductors between the films.
Locations
Radeberg
DEHeadquarters and manufacturing
- Materials
- Copper, aluminium, FR4, films, hotmelt
- Sliding-table injection molding machines
- Reflow soldering line
- Selective soldering systems
- SMD placement machines
- High-precision laser
- Longitudinal/transverse cutting systems
- Special back-adhesive bonding systems
- Robotic folding
- FMS/AMS assembly systems
- Crimping technology (TE Connectivity/Nicomatic)
Jimbolia
ROProduction
Shanghai
CNProduction
Chicago
USSite
Components
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Continuous laminating (copper conductors between films, pressure and temperature)Joining | – | – | – | – | Copper, Adhesive-coated films |
| Flat rolling of copper wiresForming | – | – | – | – | Copper |
| Longitudinal and transverse cutting (singulation of laminated flat band)Forming | – | – | – | – | Copper, Laminate |
| Stripping (special blades, connection ends)Joining | – | – | – | – | Copper, Insulating film |
| Crimping technology (crimping at 1.27 mm and 2.54 mm pitch)Joining | – | – | – | – | Copper, Aluminium |
| Overmolding (sliding-table injection molding machines)Plastics | – | – | – | – | Plastic |
| Encapsulation with hotmeltPlastics | – | – | – | – | Hotmelt |
| Back-adhesive bonding (adhesive tapes and reinforcements)Assembly | – | – | – | – | Adhesive tape |
| Laser processing (exposing, custom variants)Surface | – | – | – | – | – |
| Selective solderingJoining | – | – | – | – | Copper, SMD components |
| Reflow soldering (SMD assembly)Joining | – | – | – | – | Copper, SMD components, FR4 |
| Wave soldering (compatible)Joining | – | – | – | – | Copper |
| Resistance welding (contacting of components/PANTA cables)Joining | – | – | – | – | Copper, Aluminium |
| Laser weldingJoining | – | – | – | – | Copper |
| Laser solderingJoining | – | – | – | – | Copper |
| Crimp solderingJoining | – | – | – | – | Copper |
| SMD assembly (Surface Mount Technology)Assembly | – | – | – | – | FR4, SMD components |
| THT assembly (Through Hole Technology)Assembly | – | – | – | – | FR4 |
| Robotic folding (folding, custom designs)Assembly | – | – | – | – | – |
| Assemblage / Assembly (FMS and AMS assembly systems)Assembly | – | – | – | – | – |
| Development, prototyping, simulation and metrology (laboratory)Engineering | – | – | – | – | – |
| EOL testing of components, systems and modules / testingTesting | – | – | – | – | – |
10 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Fully hydraulic sliding-table injection molding machines | – | – | – | – | Radeberg |
| Selective soldering systems | – | – | – | – | Radeberg |
| Reflow soldering line | – | – | – | – | Radeberg |
| Placement machines (SMD pick & place) | – | – | – | – | Radeberg |
| High-precision high-power laser (laser processing) | – | – | – | – | Radeberg |
| Cutting systems (longitudinal and transverse cutting) | – | – | – | – | Radeberg |
| Special back-adhesive bonding systems | – | – | – | – | Radeberg |
| Robotic folding (folding systems) | – | – | – | – | Radeberg |
| FMS/AMS assembly systems (flexible and automatic assembly systems) | – | – | – | – | Radeberg |
| Crimping processing technology (TE Connectivity and Nicomatic) | TE Connectivity / Nicomatic | – | – | – | Radeberg |
Additional services
Quality
The quality objective is 0 PPM based on the zero-defect principle; a team led by the Director Quality deploys modern testing technology, EOL tests of components, systems and modules, as well as PPAP, IMDS and RoHS/REACH documentation.
| Evidence | Radeberg |
|---|---|
| ISO 9001 | |
| IATF 16949 | |
| ISO 14001 | |
| ISO 50001 |
History
- 1993
Foundation of SUMIDA flexible connections GmbH (entry into manufacturing technology for the electrical industry)
- 1998
Certification DIN EN ISO 9001 (TÜV Cert)
- 1999
Certification QS 9000 (TÜV Management Service GmbH)
- 2002
Certification ISO/TS 16949:1999
- 2004
Certification ISO/TS 16949:2002
- 2006
Affiliation with the SUMIDA Group
- 2008
Certification ISO/TS 16949:2002
- 2010
Certification ISO/TS 16949:2008
- 2012
Certification ISO 14001:2004
- 2014
Certification ISO/TS 16949:2009
- 2016
Certification ISO/TS 16949:2009
- 2018
Introduction of IATF 16949
- 2021
Re-certification IATF