Develops and manufactures image sensors, cameras, X-ray and infrared detectors, and spectrometers for machine vision and science
Teledyne Vision Solutions
Eindhoven (NL) · Waterloo (CA) · Bromont (CA) · Krailling/Munich (DE) · Enschede (NL) · Billerica (US)New on Amplifa
About Teledyne Vision Solutions
Teledyne Vision Solutions (TVS) consolidates the imaging technology portfolios of Teledyne DALSA, e2v, Flir IIS, Adimec, Lumenera, Photometrics, Princeton Instruments, and Judson Technologies. The portfolio includes image sensors, cameras (1D, 2D, smart cameras, SWIR, thermal/LWIR, scientific and X-ray cameras), 3D laser sensors and profilers, frame grabbers, and software development tools including AI/deep learning. Manufacturing is semiconductor-based: CCD/CMOS sensors incl. back-side thinning, MEMS fabrication in its own foundry in Bromont (Canada), and infrared detectors made from InGaAs, InSb, InAs, MCT (HgCdTe), and type-II superlattice from wafer substrate to packaging. For machine vision, integrated inspection systems for inspection, measurement, identification, and 3D laser profiling are developed. Customers come from automotive, electronics, semiconductor, food & packaging, logistics, medical, aerospace, defense, and scientific research; Teledyne Judson sensors were used in the NASA Mars 2020 (Perseverance) mission. European sales and R&D locations include Eindhoven, Krailling near Munich, and Enschede.
- Site
- Eindhoven (NL)
- Processes
- MEMS fabrication (foundry, Teledyne DALSA Semiconductor), CCD/CMOS semiconductor manufacturing incl. back-side thinning, Testing per MIL-STD 833 methods (component testing), Design and manufacturing of spectrometers and CCD/sCMOS/ICCD/EMCCD/emICCD/InGaAs cameras, Machine vision / integrated vision systems (inspection, measurement, identification), X-ray inspection / non-destructive testing (NDT) with CCD/CMOS/IGZO detectors, Manufacturing of infrared detectors (photodiodes, sensors, cameras) from wafer substrate to, MESA etch and surface passivation for InAs photodetectors
- Materials
- Silicon (CCD/CMOS, deep depletion CCD), InGaAs, InSb, InAs, MCT / HgCdTe (PC and PV), T2SL (Type-II Superlattice), IGZO (X-ray detectors), Type-II Superlattice
- Certificates
- ISO 9001:2015, ISO 9001:2017, ISO 13485:2016, ISO 14001:2015, ISO 9001, ISO 13485, ISO 14001
- 01
Wafer/substrate manufacturing (silicon, compound semiconductors)
- 02
Sensor manufacturing CCD/CMOS incl. back-side thinning, MEMS fabrication
- 03
Camera and system assembly
- 04
Software development incl. AI/deep learning
- 05
Testing per MIL-STD 833 methods / failure analysis
- 06
Integration into vision systems and OEM solutions
Materials & Manufacturing Processes
Silicon (CCD/CMOS, deep depletion CCD)
Base material for CCD/CMOS image sensors incl. deep depletion CCDs, responsive up to 1050 nm
InGaAs
Infrared detectors for the SWIR range 1.7–2.6 µm
InSb
Cryogenic and LN2-cooled IR detectors with MTBF > 25,000 h
InAs
Photodetectors up to 3.8 µm incl. MESA etch and surface passivation
MCT / HgCdTe (PC and PV)
Photoconductive and photovoltaic IR detectors up to 22 µm, VLWIR via MBE
Type-II Superlattice
IR detectors up to 5.4 µm at room temperature or TE-cooled
IGZO
Semiconductor material for flat-panel X-ray detectors for industrial applications
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| MEMS fabrication (foundry, Teledyne DALSA Semiconductor)Engineering | – | – | – | – | Silicon |
| CCD/CMOS semiconductor manufacturing incl. back-side thinningEngineering | – | – | – | – | Silicon |
| Testing per MIL-STD 833 methods (component testing)Testing | – | – | – | – | – |
| Design and manufacturing of spectrometers and CCD/sCMOS/ICCD/EMCCD/emICCD/InGaAs camerasAssembly | – | – | – | – | – |
| Machine vision / integrated vision systems (inspection, measurement, identification)Testing | – | – | – | – | – |
| X-ray inspection / non-destructive testing (NDT) with CCD/CMOS/IGZO detectorsTesting | – | – | – | – | – |
| Manufacturing of infrared detectors (photodiodes, sensors, cameras) from wafer substrate toEngineering | – | – | – | – | InSb, InGaAs, InAs, MCT (HgCdTe), T2SL |
| MESA etch and surface passivation for InAs photodetectorsSurface | – | – | – | – | InAs |
| MBE (molecular beam epitaxy) for VLWIR HgCdTe detectorsEngineering | – | – | – | – | MCT (HgCdTe) |
1 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| MEMS foundry (semiconductor manufacturing) | Teledyne DALSA Semiconductor | – | – | – | Bromont, Quebec, Canada |
Additional services
Reference customers
Quality & Certifications
Teledyne Vision Solutions maintains certified quality management systems across all brands, including lot tracking with component traceability, contamination and ESD control programs, and failure analysis services. Component testing is performed, among others, per MIL-STD 833 methods.
| Evidence | Waterloo (Ontario) | Eindhoven | Krailling (Munich) |
|---|---|---|---|
| ISO 9001 | |||
| ISO 13485 | |||
| ISO 14001 |
History
- 1960
Teledyne, Inc. was founded by Henry Singleton and George Kozmetsky
- 1969
Teledyne Judson Technologies begins producing IR detectors for OEMs and researchers
- 1981
Princeton Instruments founded; architect of the world's first spectroscopy camera with photodiode array
- 1995
First scientific gated ICCD camera
- 1998
Integrated delay generator in ICCD camera
- 1999
Teledyne Technologies spun off from Allegheny Teledyne as an independent publicly traded company
- 2001
First scientific microscopy EMCCD camera