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Tichawa Vision – Fertigung

Development, manufacturing and distribution of Contact Image Sensors (CIS) for industrial inspection and scanning applications

Tichawa Vision Logo

Tichawa Vision GmbH

Friedberg (DE)New on Amplifa

1997Founded
FriedbergLocation
up to 4 mScan width of the CIS
25–2400 dpiResolution range

About Tichawa Vision

Tichawa Vision GmbH develops, manufactures and distributes optical and electronic components and devices with a focus on Contact Image Sensors (CIS). These compact line cameras for direct mounting on the object to be inspected typically consist of a sensor line, a SELFOC lens and a light source, and are manufactured up to a scan width of 4 m. In addition to standard products such as MXCIS, VUCIS and BDCIS, the company offers modified and custom CIS solutions as well as software development. As with CCD and CMOS cameras, the sensor pixels are made of silicon with a sensitivity maximum in the near infrared. Resolutions range from 25 dpi (pixel pitch 1.016 mm) to 2400 dpi (pixel pitch 10.6 μm), and the standard working distance is 10 mm. Customers come from printing and scanning technology, the semiconductor industry (wafer inspection), digital printing and automation technology. The main site is located in Friedberg near Augsburg; the managing directors are Dr. Nikolaus Tichawa and Krisztina Tichawa.

Site
Friedberg
Processes
Development, manufacturing and distribution of optical and electronic components and devices, Custom CIS solutions / modified standard products (Contact Image Sensors), CIS with resolutions from 25 dpi (pixel pitch 1.016 mm) to 2400 dpi (pixel pitch 10.6 μm),, BDCIS - Basic Distance CIS (increased working distance, resolution up to 240 dpi as standard,, MXCIS - Maxi CIS (all-in-one: illumination, optics, sensors, data preprocessing; resolutions 100, VUCIS - VARI Universal CIS (16 illumination geometries, 10 illumination colors, 8 optics with, Modified and custom CIS solutions, Software development
Materials
Silicon (sensor pixels, typical for CCD/CMOS), Silicon, Contact Image Sensor Technology, Integrated Illumination Technology
Certificates
DIN EN ISO 9001:2015, ISO 9001
Founded
1997
Industries
Printing and scanning technology, Semiconductor industry (wafer inspection), Automation technology, Digital Printing
  1. 01

    Engineering and software development

  2. 02

    Manufacturing of the CIS modules

  3. 03

    Distribution and customer service

  4. 04

    Support

Materials & Technology

Si

Silicon

As with CCD and CMOS cameras, the sensor pixels of the CIS are made of silicon with a sensitivity maximum in the near infrared.

CIS

Contact Image Sensor Technology

Compact line camera with 1:1 imaging via a SELFOC lens, scan width up to 4 m and a constant viewing angle across the entire width.

LED

Integrated Illumination Technology

The CIS supports multiplexed operation of up to six light sources, with colors from IR to UV.

Locations

Standort Friedberg

Friedberg

DE

Main site: development, manufacturing and distribution

Materials
Silicon (sensor pixels)

Products & Sensors

MXCIS – Maxi CIS
MXCIS – Maxi CISContact Image Sensor · Printing and scanning technology
BDCIS – Basic Distance CIS
BDCIS – Basic Distance CISContact Image Sensor · Automation technology
VTCIS
VTCISContact Image Sensor · Surface inspection
VUCIS – VARI Universal CIS
VUCIS – VARI Universal CISContact Image Sensor · Automation technology

Inside the production

MXCIS – Maxi CIS
MXCIS – Maxi CIS
CIS manufacturing
CIS manufacturing
CIS technology
CIS technology

Industries

Printing and scanning technologySemiconductor industry (wafer inspection)Automation technologyDigital Printing

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
Development, manufacturing and distribution of optical and electronic components and devicesInspection––––Silicon
Custom CIS solutions / modified standard products (Contact Image Sensors)Engineering–4 m–––
CIS with resolutions from 25 dpi (pixel pitch 1.016 mm) to 2400 dpi (pixel pitch 10.6 μm),Inspection–4 m–––
BDCIS - Basic Distance CIS (increased working distance, resolution up to 240 dpi as standard,Inspection–––––
MXCIS - Maxi CIS (all-in-one: illumination, optics, sensors, data preprocessing; resolutions 100Inspection–4 m–––
VUCIS - VARI Universal CIS (16 illumination geometries, 10 illumination colors, 8 optics withInspection–––––

Additional services

Development, manufacturing and distribution of optical and electronic components and devicesModified and custom CIS solutionsSoftware developmentSupportCustomer service in sales

Reference customers

AVT LTD.BCN VisionFraunhofer AutomatisierungstechnikGüdel AGHecht Electronic AGi-mation vision solutionsInternationale HochschuleLanda Digital PrintingnaaijkensOpto GmbHPeter Scholz Software + Engineering GmbH

Quality

The management system of Tichawa Vision GmbH is certified to DIN EN ISO 9001:2015 by Intertek (initial certification in 2000). The scope covers the development, manufacturing and distribution of optical and electronic components and devices.

EvidenceFriedberg
ISO 9001

History

  1. 1991

    Founding of the Tichawa engineering office

  2. 1997

    Founding of Tichawa Vision GmbH

  3. 2000

    Initial certification to ISO 9001 on 29 August

  4. 2001

    Krisztina Tichawa becomes managing director of Tichawa Vision GmbH

  5. 2011

    Founding/management of Tichawa IP GmbH by Krisztina Tichawa

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