Sales and consulting for Japanese semiconductor and photonics manufacturing equipment in Europe.
TomoSemi GmbH
Central EuropeNew on Amplifa
About TomoSemi
TomoSemi GmbH is a sales and consulting provider specialized in semiconductor manufacturing equipment from Japan, serving photonics fabs and labs in Central Europe. The portfolio includes tools for Scribe & Break (diamond and laser scribes, breakers), bar stacking, fully automatic optical inspection, as well as testing and probing from the manufacturer OPTO SYSTEM. In addition, ECR plasma coating systems and magnetron sputtering systems for thin-film applications such as laser diode mirror coatings, oxidation tools, and photolithography and lift-off solutions from ASAP are brokered. TomoSemi provides technical consulting, local support in the European time zone including on-site service, and acts as a bridge between customers and Japanese manufacturers, including communication in Japanese, German and English. With more than twelve years of experience in the laser diode industry, the team understands the requirements of opto-electronic and power device manufacturing. Additionally, the company offers knowledge resources via a wiki on laser diodes, facets, failure mechanisms and ECR coating.
- Site
- Central Europe
- Processes
- Scribe & Break (diamond scribe, laser scribe, breaker for dicing wafers into bars/dies), Bar Stacking (stacking of semiconductor bars for facet processing), Optical Inspection (fully automatic, including underside and facets), ECR plasma thin-film coating (electron cyclotron resonance, laser diode mirror coating,, Magnetron Sputtering, Plasma Etch / Plasma Treatment, Oxidation Tools (Oxidization), Testing & Probing (fully automatic wafer probers, chip testers, bar testers for opto-electronics and
- Materials
- Laser diodes / opto-electronic and power devices (semiconductors), ECR Plasma Coating, Magnetron Sputtering, Photolithography (ASAP), Lift-Off, Scribe & Break, Optical Inspection, Testing & Probing
- Industries
- Photonics fabs and labs, Semiconductor manufacturing, Laser diode manufacturing, Opto-electronic devices, Power devices, Opto-electronic and power device manufacturing
- 01
Consulting and equipment selection
- 02
Sales of Japanese manufacturing equipment
- 03
On-site installation and commissioning
- 04
Technical support and maintenance in Europe
Systems & Processes
ECR Plasma Coating
Thin-film deposition for laser diode mirror coatings as well as optical and insulator layers.
Magnetron Sputtering
Process for thin-film deposition in semiconductor manufacturing.
Photolithography (ASAP)
Customizable lithography solutions with approximately 1 µm resolution and low operating costs.
Lift-Off
Lift-off technology from the ASAP solution portfolio for patterning processes.
Scribe & Break
Dicing of wafers into bars and dies using diamond and laser scribes as well as breakers from OPTO SYSTEM.
Optical Inspection
Fully automatic visual inspection of all device sides including underside and facets.
Testing & Probing
Fully automatic characterization and sorting of opto-electronic and power devices.
Systems & Equipment
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Scribe & Break (diamond scribe, laser scribe, breaker for dicing wafers into bars/dies)Joining | – | – | – | – | Semiconductor wafers |
| Bar Stacking (stacking of semiconductor bars for facet processing)Assembly | – | – | – | – | Semiconductors |
| Optical Inspection (fully automatic, including underside and facets)Testing | – | – | – | – | – |
| ECR plasma thin-film coating (electron cyclotron resonance, laser diode mirror coating,Surface | – | – | – | – | – |
| Magnetron SputteringSurface | – | – | – | – | – |
| Plasma Etch / Plasma TreatmentSurface | – | – | – | – | – |
| Oxidation Tools (Oxidization)Heat Treatment | – | – | – | – | – |
| Testing & Probing (fully automatic wafer probers, chip testers, bar testers for opto-electronics andTesting | – | – | – | – | – |
| Photolithography (~1 µm resolution)Surface | ~1 µm | – | – | – | – |
| Lift-OffSurface | – | – | – | – | – |
7 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Diamond Scriber / Laser Scriber / Breaker (Scribe & Break) | OPTO SYSTEM | – | – | – | – |
| Bar Stacker (fully automatic) | OPTO SYSTEM | – | – | – | – |
| Automatic optical inspection systems | OPTO SYSTEM | – | – | – | – |
| ECR plasma coating systems (Thin Film Coating) | – | – | – | – | – |
| Magnetron sputtering systems | – | – | – | – | – |
| Wafer Prober / Chip Tester / Bar Tester / Sorter | OPTO SYSTEM | – | – | – | – |
| Photolithography and lift-off systems | ASAP | – | – | – | – |
Additional services
History
- 2020
First publication of the website (26.04.2020).