Tresky manufactures manual and semi-automatic die-bonding systems for research, development and small series.
Tresky
SwitzerlandNew on Amplifa
About Tresky
Tresky is a Swiss manufacturer of die-bonding systems and has been developing manual and semi-automatic die-bonder platforms for research, development and small series since 1980. The systems of the T-5000 series cover applications such as flip-chip bonding, thermosonic flip-chip, copper pillar bonding, sinter bonding, thermocompression, UV bonding and RFID bonding. Thanks to True Vertical Technology™, a placement accuracy of less than ±1 µm is achieved. More than 2'500 installed systems are in use worldwide, particularly in the semiconductor industry, photonics and optoelectronics, the automotive and transport sector, aerospace engineering and medical technology. The Switzerland-based company offers application consulting as well as virtual product demonstrations in an online showroom in addition to its systems.
- Site
- Switzerland
- Processes
- Die bonding, Flip-chip bonding, Thermosonic flip-chip, Copper pillar bonding, Sintering (sinter bonding), Thermocompression, UV bonding, RFID bonding
- Materials
- Flip-Chip Bonding, Thermosonic Flip-Chip, Copper Pillar Bonding, Sinter Bonding, Thermocompression, UV Bonding, RFID Bonding
- Founded
- 1980
- Industries
- Semiconductor industry, Photonics / Optoelectronics, Automotive / Transport, Aerospace engineering, Medical technology, Research and development
- 01
Engineering and development of the die-bonder platforms
- 02
Manufacturing and assembly of the systems (Swiss Made)
- 03
Application consulting (flip-chip, sintering, thermocompression, UV bonding)
- 04
Virtual machine demonstration / online showroom
- 05
Support and worldwide sales
Applications & Processes
Flip-Chip Bonding
Precise bonding of chips for applications in research, development and production.
Thermosonic Flip-Chip
Thermosonic flip-chip bonding for reliable connections.
Copper Pillar Bonding
Bonding with copper pillars for demanding electronics applications.
Sinter Bonding
Sintering for thermally and electrically high-performance die connections.
Thermocompression
Thermocompression bonding for precise and reproducible processes.
UV Bonding
UV bonding for individual adhesive and joining tasks.
RFID Bonding
Bonding of RFID components on the Tresky platforms.
Site
Switzerland
DEDevelopment, manufacturing and sales
- Lot size
- Prototypes, research, development, small series
- Materials
- Semiconductors, photonics, electronic components
- T-4909-AE (manual die-bonder platform)
- T-5100 (manual die-bonder platform)
- T-5100-W (manual die-bonder platform)
- T-5300 (semi-automatic die-bonder platform)
- T-5300-W (semi-automatic die-bonder platform)
- T-5500 (semi-automatic die-bonder platform)
- T-5000 series
Applications
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Die bondingJoining | < ±1 µm (True Vertical Technology™) | – | – | – | – |
| Flip-chip bondingJoining | – | – | – | – | – |
| Thermosonic flip-chipJoining | – | – | – | – | – |
| Copper pillar bondingJoining | – | – | – | – | Copper |
| Sintering (sinter bonding)Joining | – | – | – | – | – |
| ThermocompressionJoining | – | – | – | – | – |
| UV bondingJoining | – | – | – | – | – |
| RFID bondingJoining | – | – | – | – | – |
7 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Manual die-bonder platform | Tresky T-4909-AE | – | – | – | Switzerland |
| Manual die-bonder platform | Tresky T-5100 | – | – | – | Switzerland |
| Manual die-bonder platform | Tresky T-5100-W | – | – | – | Switzerland |
| Semi-automatic die-bonder platform | Tresky T-5300 | – | – | – | Switzerland |
| Semi-automatic die-bonder platform | Tresky T-5300-W | – | – | – | Switzerland |
| Semi-automatic die-bonder platform | Tresky T-5500 | – | – | – | Switzerland |
| Die-bonder platform (series) | Tresky T-5000 series | – | – | – | Switzerland |
Additional services
History
- 1980
Founded as a Swiss manufacturer of die-bonding systems – Swiss engineering since 1980
- 2025
45 years of experience and over 2'500 installed systems worldwide; launch of the T-5000 series