Plant engineering and service for horizontal wet-chemical processes in PCB manufacturing
TSK Schill
Gäufelden (Headquarters) · Görlitz (Branch office)New on Amplifa
About TSK Schill
TSK Schill is a machinery and plant manufacturer specializing in horizontal wet-chemical processes, headquartered in Gäufelden with a branch office in Görlitz. The company develops and manufactures individually configured systems for the entire PCB (printed circuit board) production process: from pre-cleaning, developing, etching (DES/SES), Vacuum Etch, resist stripping, desmearing and through-hole plating to finishing, immersion tin, OSP and silver coating. The portfolio is complemented by final cleaning, pumice brushing, developer and roll-to-roll systems as well as special machines such as the drawer etcher for individual parts and small series. Services include 3D-CAD design including electrical design, prototype and test setups, commissioning, as well as service, maintenance, modernization and spare parts supply — also for third-party equipment. Systems are built from polypropylene, PVC, PVDF, stainless steel and titanium and are equipped with Siemens controls (S7 TIA Portal) as well as OPC-UA and MES interfaces. Customers are PCB manufacturers and automotive suppliers in industries such as e-mobility, industrial, medical technology, telecommunications, solar, defense and consumer electronics; the systems are in operation internationally.
- Site
- Gäufelden
- Processes
- Developer systems (resist developing, horizontal wet-chemical processes), Final cleaning (cleaning after milling, removal of dust particles), Pumice brushing (deburring, deoxidation, cleaning of panels), Vacuum Etch / Vacu-Etch etching (PCB >410mm x 410mm, also smaller working widths), Pre-cleaning (degreasing, micro-etching, oxide removal, activation), Resist stripping, Desmearing (hole cleaning), Through-hole plating (Directplating PTH)
- Materials
- Copper, Epoxy resin (glass-fiber reinforced, base material), Polyimide (film for flexible circuit boards), Teflon (film for flexible circuit boards), Polypropylene (plant construction material), PVC (plant construction material), PVDF (plant construction material), Stainless steel (plant construction material)
- Industries
- PCB manufacturing, E-mobility, Industrial, Medical technology, Telecommunications, Solar
- 01
Inquiry and requirements analysis
- 02
Design (3D-CAD, electrical design)
- 03
Manufacturing of the system
- 04
Commissioning and acceptance
- 05
Service, maintenance, spare parts, modernization
Materials & Processes
Polypropylene
Plastic-based plant construction material for tanks and process components in wet processes.
PVC
Plant construction material for corrosion-resistant components in wet-chemical lines.
PVDF
Highly chemically resistant plant construction material for demanding wet-chemical processes.
Stainless Steel
Plant construction material for structural and process-adjacent components.
Titanium
Plant construction material for components subject to particularly high corrosion stress in etching processes.
Copper
Material of the circuit boards, processed in developer, etching, through-hole plating and coating systems.
Epoxy resin (glass-fiber reinforced)
Base material of rigid circuit boards, treated in pre- and final cleaning processes.
Polyimide
Film for flexible circuit boards, also processed in roll-to-roll concepts.
Teflon
Film for flexible circuit boards in pre-cleaning and roll-to-roll applications.
Locations
Gäufelden (Headquarters)
DEHead office, development, sales and plant engineering
- Materials
- Polypropylene, PVC, PVDF, stainless steel, titanium
- Developer system (horizontal, TSK)
- 3D-CAD design
- Electrical design with Siemens S7 TIA Portal
Görlitz
DEBranch office
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Developer systems (resist developing, horizontal wet-chemical processes)Surface | – | – | – | – | Copper, Epoxy resin (base material) |
| Final cleaning (cleaning after milling, removal of dust particles)Surface | – | – | – | – | glass-fiber reinforced epoxy resin |
| Pumice brushing (deburring, deoxidation, cleaning of panels)Surface | – | – | – | – | punched sheets/steel |
| Vacuum Etch / Vacu-Etch etching (PCB >410mm x 410mm, also smaller working widths)Surface | – | 410 mm × 410 mm | – | – | Copper (CuCl2, alkaline etching solution, FeCl3) |
| Pre-cleaning (degreasing, micro-etching, oxide removal, activation)Surface | – | – | – | – | Copper, Epoxy resin, Polyimide, Teflon |
| Surface | – | – | – | – | Copper |
| Resist strippingSurface | – | – | – | – | Copper |
| Desmearing (hole cleaning)Surface | – | – | – | – | – |
| Through-hole plating (Directplating PTH)Surface | – | – | – | – | Copper |
| Immersion tin coating (horizontal immersion tin line)Surface | – | – | – | – | Copper |
| OSP / organic coatingSurface | – | – | – | – | Copper |
| Silver CoatingSurface | – | – | – | – | Copper |
| Finishing of circuit boardsSurface | – | – | – | – | Copper |
| Spray processes, immersion processes, high-pressure and ultrasonic cleaning, vacuum technology inSurface | – | – | – | – | – |
| Roll-to-roll systems (for flexible circuit boards)Surface | – | – | – | – | Polyimide, Teflon |
| Engineering | – | – | – | Small series/individual parts | Glass |
| Plant engineering for PCB production incl. e-mobility, solar, pattern plating etchingEngineering | – | – | – | – | Copper |
| Pattern plating etchingSurface | – | – | – | – | – |
| Assembly | – | – | – | – | – |
19 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Developer system (horizontal) | TSK | – | – | – | Gäufelden (Headquarters) |
| Final cleaning system | TSK | – | – | – | – |
| Pumice brushing system | TSK | – | – | – | – |
| Vacu-Etch system (vacuum etching system) | TSK | – | >410 mm x 410 mm (adaptable) | – | – |
| Pre-cleaning system | TSK | – | – | – | – |
| Etching system (horizontal, incl. alkaline etching line) | TSK | – | – | – | – |
| Resist-strip cleaning line | TSK | – | – | – | – |
| Desmearing system | TSK | – | – | – | – |
| Through-hole plating system (Directplating PTH) | TSK | – | – | – | – |
| Immersion tin line (horizontal) | TSK | – | – | – | – |
| OSP system (organic coating) | TSK | – | – | – | – |
| Silver coating system | TSK | – | – | – | – |
| Drawer etcher (special machine for individual parts/small series) | TSK | – | – | – | – |
| Glass panel cleaning system (special process) | TSK | – | – | – | – |
| Prototype systems (special machine construction, horizontal wet-chemical) | TSK | – | – | – | – |
| Solar PCB system | TSK | – | – | – | – |
| PCB system for e-mobility | TSK | – | – | – | – |
| Pattern plating etching system | TSK | – | – | – | – |
| Roll-to-roll system | TSK | – | – | – | – |
Additional services
Reference customers