Electronic Design and Manufacturing Services (DMS/EMS): SiP module packaging, PCBA, power semiconductor packaging and global supply chain services.
Universal Scientific Industrial Co., Ltd. (USI / 環旭電子)
Kunshan · Suzhou · Huizhou · worldwide service network (China, Taiwan, USA, Europe)New on Amplifa
About USI
Universal Scientific Industrial (USI, 環旭電子) is a Taiwanese electronics service provider offering design and manufacturing services (DMS/EMS) for electronic products. The service portfolio includes System-in-Package (SiP) module packaging for miniaturization, printed circuit board assembly (PCBA), electronic design (electrical design, RF/antennas, audio/acoustics, mechanics, network and storage solutions, smart car systems), design qualification, supply chain management, quality inspection, certification as well as after-sales service via a global service network. Products and solutions serve the markets of wireless communication, cloud & storage, industrial and medical technology, consumer electronics, automotive electronics, wearables, IoT and optical communication; in the automotive sector, USI points to more than 40 years of experience and OE customers. In 2026, USI presented a SiC embedding technology at PCIM Europe: SiC chips are embedded in multilayer ABF substrates, combined with SSC module packaging (a copper surface), ceramic isolation substrates and wireless bonding technology. Further topics are AI vision inspection for the smart factory and a cooperation with Agile Robots SE in the field of humanoid and collaborative robotics. Manufacturing and service locations exist worldwide, including in China, Taiwan, the USA and Europe.
- Site
- Kunshan
- Processes
- SiP (System-in-Package) module packaging / system-level packaging, Printed circuit board assembly (PCBA) manufacturing services, Electronic product design and manufacturing services (DMS/EMS), High-density ICT electrical testing, Power semiconductor packaging: SiC chips pre-embedded in multilayer ABF substrate, single-sided, AI vision inspection (quality inspection/process automation), SiP module design and manufacturing (miniaturization), Electronic design (electrical design, RF/antennas, audio/acoustics, mechanics, network solutions,
- Materials
- Silicon carbide (SiC) chips, ABF substrate (multilayer), Ceramic isolation substrate, SiC chips (碳化矽晶粒), Multilayer ABF substrate
- Founded
- 1976
- Industries
- Wireless communication, Cloud & Storage, Industrial electronics & medical technology, Consumer electronics, Automotive electronics, Optical communication
- 01
Electronic design (electrical design, RF/antennas, audio, mechanics, network,
- 02
Design quality & validation
- 03
SiP module packaging / PCBA manufacturing
- 04
Power semiconductor packaging (SiC embedding)
- 05
Quality inspection & certification
- 06
Supply chain management
- 07
After-sales service
Materials & Processes
SiC chips (碳化矽晶粒)
Silicon carbide chips are embedded in multilayer ABF substrates (SiC embedding packaging technology).
Multilayer ABF substrate
Base material for the embedding of SiC chips in power semiconductor packaging.
Ceramic isolation substrate
Used in SSC power modules with a single-sided exposed copper surface.
Locations
Kunshan
CNManufacturing site (Smart Manufacturing)
Suzhou
CNManufacturing site
Huizhou
CNManufacturing site
Products & Components
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SiP (System-in-Package) module packaging / system-level packagingAssembly | – | – | – | – | – |
| Printed circuit board assembly (PCBA) manufacturing servicesAssembly | – | – | – | – | – |
| Electronic product design and manufacturing services (DMS/EMS)Engineering | – | – | – | – | – |
| High-density ICT electrical testingTesting | – | – | – | – | – |
| Power semiconductor packaging: SiC chips pre-embedded in multilayer ABF substrate, single-sidedAssembly | – | – | – | – | Silicon carbide (SiC), ABF substrate, Ceramic isolation substrate |
| AI vision inspection (quality inspection/process automation)Testing | – | – | – | – | – |
Additional services
Reference customers
History
- 1976
Founding of USI (Universal Scientific Industrial); the company advertises its 50th anniversary in 2026 (1976–2026).
- 1989
ABIT Computer Corporation is founded, later acquired by USI.
- 2000
ABIT IPO on the TAIEX; construction of a factory in Suzhou, China.
- 2006
In May, USI takes over the motherboard business and the ABIT brand (Universal ABIT).
- 2009
The ABIT brand is discontinued on March 31.
- 2026
USI America Inc. signs MOU with Agile Robots SE (humanoid/collaborative robotics); presentation of the SiC embedding power packaging technology at PCIM Europe 2026; 4th time S&P Global ESG Score Top 1% of Chinese companies; 5th consecutive year in the S&P Global Sustainability Yearbook (Top 5