Development and manufacturing of optoelectronic components for ultra-fast data transmission up to 400 Gbps per channel
VI Systems GmbH
BerlinNew on Amplifa
About VI Systems
VI Systems GmbH (VIS) is a developer, manufacturer and marketer of optoelectronic components for optical communication and sensing applications. The Berlin-based company develops and produces energy-efficient Vertical-Cavity Surface-Emitting Lasers (VCSELs), PIN photodetectors and related assemblies for ultra-fast data transmission with target speeds of 400 Gbps per channel over single- and multimode fiber, optical wireless and sensing applications. VI Systems focuses on the design, development and IP protection of advanced optical and electronic components and sub-assemblies, followed by technology transfer to customer facilities or in-house manufacturing via a chain of foundries. The offering includes optical and electrical testbeds up to 128 Gb/s as well as characterization methods such as near- and far-field measurement, IR imaging, focused ion beam (FIB) etching and full wafer mapping. SiGe BiCMOS integrated circuits are integrated into optoelectronic assemblies in proprietary high-frequency single-channel or multichannel designs. The portfolio is protected by 10 granted US patents and associated patent families.
- Site
- Berlin
- Processes
- Design and Prototyping / Modeling (3D Modeling), High Frequency Testing, Full Wafer Mapping / automated device inspection on wafer level, Testing and Characterization (near/far field, IR imaging, FIB etching, TEM, chemical analysis), Assemblies (high frequency single- or multichannel design, optoelectronic assemblies), Focused ion beam (FIB) etching of micro-devices, Design and prototyping, 3D modeling
- Materials
- Single Mode VCSEL (Vertical-Cavity Surface-Emitting Laser), PIN Photodetector, SiGe BiCMOS integrated circuits, SiGe BiCMOS Integrated Circuits
- Certificates
- Automated wafer-level inspection, High-frequency testbeds up to 128 Gb/s, Full wafer mapping
- Industries
- Optical Communication, Datacenter Networks, Sensing, Photonics, AI Optical Links
- 01
Design and 3D modeling
- 02
Prototyping
- 03
Wafer manufacturing via foundry chain
- 04
Wafer-level inspection and full wafer mapping
- 05
High-frequency testing and characterization
- 06
Assembly (SiGe BiCMOS)
- 07
Technology transfer and IP licensing
Technologies and Processes
Single Mode VCSEL (Vertical-Cavity Surface-Emitting Laser)
Laser chips for ultra-fast data transmission and sensing up to 100–200 Gbps
PIN Photodetector
Receiver device for optical communication and sensing applications
SiGe BiCMOS Integrated Circuits
High-frequency amplifiers and drivers (56 GBaud), integrated into optoelectronic assemblies
Locations
Berlin
DEHeadquarters / Development
- Lot size
- Prototype to technology transfer
- Materials
- VCSELs, PIN photodetectors, SiGe BiCMOS
- Automated wafer-level inspection facility
- High-frequency testbeds (optical/electrical) up to 128 Gb/s
- FIB etching with transmission electron microscopy and chemical analysis
Components and Assemblies
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Design and Prototyping / Modeling (3D Modeling)Engineering | – | – | – | – | – |
| High Frequency TestingTesting | – | – | – | – | – |
| Full Wafer Mapping / automated device inspection on wafer levelTesting | – | – | – | – | – |
| Testing and Characterization (near/far field, IR imaging, FIB etching, TEM, chemical analysis)Testing | – | – | – | – | – |
| Assemblies (high frequency single- or multichannel design, optoelectronic assemblies)Assembly | – | – | – | – | SiGe BiCMOS |
| Focused ion beam (FIB) etching of micro-devicesMachining | – | – | – | – | – |
2 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Automated wafer-level device inspection facility | – | – | Wafer level | – | – |
| High frequency testbeds (optical/electrical) | – | – | up to 128 Gb/s | – | – |
Additional services
Quality and Characterization
VI Systems operates an automated wafer-level inspection facility as well as optical and electrical testbeds up to 128 Gb/s. Characterization includes near- and far-field measurement, IR imaging of the oxide-confined aperture, FIB etching combined with transmission electron microscopy, and chemical analysis of the extracted layers; these facilities are also offered as a service to customers.
| Evidence | Berlin |
|---|---|
| Automated wafer-level inspection | |
| High-frequency testbeds up to 128 Gb/s | |
| Full wafer mapping |
History
- 2015
Website launch of VI Systems GmbH
- 2025
Expansion of patent families for next-generation AI optical links
- 2026
CEO Nikolay Ledentsov included in The Photonics100
- 2026
Recognition at the Company of the Year Awards Germany 2026