Manufacturer of LTCC ceramic substrates, packages, boards and assemblies for the electronics and sensor industries
VIA electronic GmbH
HermsdorfNew on Amplifa
About VIA electronic
VIA electronic GmbH, based in Hermsdorf (Thuringia), is a manufacturer of components in LTCC technology (Low Temperature Co-Fired Ceramic). The company produces multilayer ceramic substrates in which several ceramic layers are fired together with metallic conductor traces in a co-firing process at 850–900 °C. The product range includes LTCC packages, standard and sensor packages, LTCC boards such as interposers and planar structures, as well as assemblies with soldered-on frame elements and pins. LTCC technology enables powerful multilayer structures on ceramic substrates with low signal loss, good heat dissipation and high reliability. The company is part of the globally operating KOA group of companies with the Japanese parent company KOA Corporation. Customers receive individual consulting from the company's own engineers, including on the Technology Suites for High Density Interconnection and Harsh Environment applications.
- Site
- Hermsdorf
- Processes
- LTCC (Low Temperature Co-Fired Ceramic) – multilayer ceramic substrates with metal conductors, LTCC packages, standard packages, sensor packages, LTCC boards (e.g. interposers, planar structures), LTCC assembly (e.g. soldered-on frames, pins), High Density Interconnection & Harsh Environment Technology Suites, LTCC manufacturing (Low Temperature Co-Fired Ceramic), Multilayer ceramic substrates, LTCC boards (interposers, planar structures)
- Materials
- LTCC ceramic (Low Temperature Co-Fired Ceramic), Metal (conductor traces/conductive pastes), Metal conductors (conductive pastes)
- Industries
- Electronics industry, Sensor technology
- 01
Engineering consulting
- 02
LTCC manufacturing (multilayer ceramic substrates)
- 03
Assembly (e.g. soldered-on frames, pins)
Materials and Processes
LTCC ceramic (Low Temperature Co-Fired Ceramic)
Ceramic material for multilayer substrates, fired in co-firing at 850–900 °C together with metal conductors.
Metal conductors (conductive pastes)
Form conductive paths for signals and power within the ceramic multilayer structure.
Sites
Hermsdorf
DEHeadquarters
- Materials
- LTCC ceramic, metal conductors
LTCC Components
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| LTCC (Low Temperature Co-Fired Ceramic) – multilayer ceramic substrates with metal conductorsCasting | – | – | – | – | LTCC ceramic, Metal conductors (conductive pastes) |
| LTCC packages, standard packages, sensor packagesCasting | – | – | – | – | LTCC ceramic |
| LTCC boards (e.g. interposers, planar structures)Casting | – | – | – | – | LTCC ceramic |
| LTCC assembly (e.g. soldered-on frames, pins)Assembly | – | – | – | – | LTCC ceramic, Metal (soldered joints) |
| High Density Interconnection & Harsh Environment Technology SuitesEngineering | – | – | – | – | LTCC ceramic |
Additional services
History
Part of the globally operating KOA group of companies (Japanese parent company KOA Corporation)