EMS provider for SMD and THT assembly, module manufacturing, coating and functional testing – from prototype to large series.
Visatronic GmbH
Mainhausen (Dieselstraße 19) · Mainhausen (Dieselstraße 16)New on Amplifa
Custom-tailored electronics manufacturing
Visatronic GmbH is a family-owned electronics manufacturing services (EMS) company based in Mainhausen. The company manufactures custom electronic modules using SMD and THT technology, flexible printed circuit assemblies and complete electronic devices – from conception through design and component procurement to series production. Manufacturing includes stencil printing and jet printing of solder paste, reflow, selective, wave and vapor phase soldering, 3D-AOI and 3D-SPI inspection, fully automated coating (conformal coating) as well as functional testing. Production ranges from prototype to large series; with the FUJI NXTR assembly line, productions from a quantity of 10,000 units are possible. Customers come from the electronics industry, medical technology, measurement, control and regulation technology and power electronics; Visatronic modules are used, among other things, in the measurement technology of CERN. Since 2023, Visatronic has been a subsidiary of the BMZ Group; the approximately 1500 m² plant with production and administration is located on Dieselstraße in Mainhausen.
- Site
- Mainhausen
- Processes
- SMD assembly, THT assembly (through-hole technology, conventional assembly, single/double-sided and, Stencil printing (squeegee printing) of solder paste and adhesive, Jet printing / contactless dispensing of solder paste (esp. prototypes, small quantities), Reflow soldering of SMD components, Selective soldering, Wave soldering, Vapor phase soldering
- Materials
- Printed circuit board, Solder paste, Solder, Adhesive, Printed circuit boards
- Certificates
- ISO 9001:2015, EN ISO 13485:2016 + AC:2018 + A11:2021, ISO 9001, ISO 13485
- Founded
- 1976
- Industries
- Electronics industry, Medical technology, Measurement, control and regulation technology, Power electronics, Measurement technology/research, Measurement technology/research (CERN project)
- 01
Conception and design
- 02
Component and PCB procurement
- 03
Stencil printing / jet printing of solder paste
- 04
SMD and THT assembly
- 05
Reflow, selective, wave and vapor phase soldering
- 06
3D SPI and 3D AOI inspection
- 07
Coating / conformal coating
- 08
Functional testing
- 09
Device assembly and mounting
Materials and consumables
Printed circuit boards
Single- and double-sided as well as mixed-assembled PCBs in SMT and THT technology form the core material of manufacturing.
Solder paste
Applied in stencil printing and contactlessly via jet printing, and melted in the reflow process.
Solder
Used in reflow, selective, wave and vapor phase soldering systems to create reliable electrical connections.
Adhesive
Used in the printing process to attach electronic components to the PCB.
Sites
Mainhausen
DEHeadquarters, production and administration
- Lot size
- Prototype to large series (SMD from quantity 10,000 with FUJI NXTR)
- Materials
- PCBs, solder paste, solder, adhesive
Modules and services
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMD assemblyAssembly | – | – | – | from quantity 10,000 with FUJI NXTR | PCBs, electronic components |
| THT assembly (through-hole technology, conventional assembly, single/double-sided andAssembly | – | – | – | – | PCBs |
| Stencil printing (squeegee printing) of solder paste and adhesiveAssembly | – | – | – | – | solder paste, adhesive |
| Jet printing / contactless dispensing of solder paste (esp. prototypes, small quantities)Assembly | – | – | – | – | solder paste |
| Reflow soldering of SMD componentsJoining | – | – | – | – | solder, solder paste |
| Selective solderingJoining | – | – | – | – | solder |
| Wave solderingJoining | – | – | – | – | solder |
| Vapor phase solderingJoining | – | – | – | – | solder |
| Coating / conformal coating (fully automated coating system)Surface | – | – | – | – | – |
| 3D AOI (automated optical inspection)Inspection | – | – | – | – | – |
| 3D SPI (solder paste inspection: height, volume, area)Inspection | – | – | – | – | solder paste |
| Functional testing of modules (VISAtest)Inspection | – | – | – | – | – |
| Laser markingSurface | – | – | – | – | – |
| Production of custom electronic modules, flexible circuit assemblies and devicesAssembly | – | – | – | Prototype – Large series production | PCBs |
| Conception, design and procurement of componentsEngineering | – | – | – | – | – |
| Drying of components (drying cabinet, drying oven, vacuum packaging with nitrogen flooding)Surface | – | – | – | – | – |
24 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMD assembly line (8 modules) | FUJI NXTR (NXT-R) | 1 | – | – | Mainhausen |
| Placement machine | Mycronic MY100 | 3 | – | – | Mainhausen |
| Placement machine | Mycronic MY200 | 2 | – | – | Mainhausen |
| SMD Tower (component storage system) | Mycronic | 4 | – | – | Mainhausen |
| Jet printer / jet dispenser | Mycronic MY600 | 1 | – | – | Mainhausen |
| Stencil printer (squeegee printer) | EKRA SERIO 4000 | 2 | – | – | Mainhausen |
| Stencil printer | H450 | 1 | – | – | Mainhausen |
| 3D AOI (automated optical inspection) | GÖPEL | 3 | – | – | Mainhausen |
| 3D SPI (solder paste inspection) | GÖPEL | 1 | – | – | Mainhausen |
| Selective soldering system | Zipatec | 1 | – | – | Mainhausen |
| Selective soldering system | ERSA ECOSELECT | 1 | – | – | Mainhausen |
| Wave soldering system | SEHO SEHO8140 | 1 | – | – | Mainhausen |
| Convection oven (reflow oven) | SEHO PR2.4 | 1 | – | – | Mainhausen |
| Convection oven (reflow oven) | SMT R360 | 1 | – | – | Mainhausen |
| Vapor phase soldering system | IBL BLC620 | 1 | – | – | Mainhausen |
| Coating cell (conformal coating) | MYC50 | 2 | – | – | Mainhausen |
| Drying cabinet | Totech SuperDry | 1 | – | – | Mainhausen |
| Vacuum packaging device with nitrogen flooding | BOSS | 1 | – | – | Mainhausen |
| Incoming goods scanner | CompControl | 1 | – | – | Mainhausen |
| X-ray component counter | Hawkeye | 1 | – | – | Mainhausen |
| Stencil washing system | Kolb | 1 | – | – | Mainhausen |
| Drying oven (infrared) | MYIR1900 | 1 | – | – | Mainhausen |
| Laser marker | YJ Link | 1 | – | – | Mainhausen |
| Labeling cell | ASYS | 1 | – | – | Mainhausen |
Additional services
Reference customers
Quality and certification
Manufacturing is certified according to DIN ISO 9001:2015 and EN ISO 13485:2016 (DEKRA). Quality assurance includes, among other things, 3D-SPI solder paste inspection, 3D-AOI systems from Göpel and functional testing with the in-house developed test device VISAtest.
| Evidence | Mainhausen |
|---|---|
| ISO 9001 | |
| ISO 13485 |