
Service provider for SMD, THT and mixed placement of printed circuit boards including soldering, assembly, potting and material procurement

Walter Nägele Leiterplattenbestückung
87784 WesterheimNew on Amplifa
About us
Walter Nägele Leiterplattenbestückung is a sole proprietorship based in Westerheim (district of Unterallgäu) and works as an outsourcing partner for mid-sized industry as well as for engineering offices. The company produces PCB assemblies from prototype through to series – single-sided and double-sided – in the SMD field as well as conventional (THT) placement. Production includes screen printing of solder and adhesive paste, SMD placement (components from 0402 to QFP 50 x 50 mm, pitch 0.5 mm), reflow soldering, wave soldering, selective soldering and hand soldering; vapor phase soldering is planned. Further services include component preparation (bending, cutting, crimping), adhesive technology, small-device and enclosure assembly with torque-adjustable electric screwdrivers, partial conformal coating of PCBs with PETERS paints as well as potting of tested assemblies. In addition, the company takes on material purchasing on request, carries out functional tests and visual inspections, and offers a pickup and delivery service as well as an express service within five working days with complete material provision.
- Site
- Westerheim
- Processes
- SMD placement, THT placement, Mixed placement (SMD + THT), Reflow soldering, Selective soldering, Wave soldering, Vapor phase soldering (planned/future), Hand soldering
- Materials
- SMD components 0402 to QFP (50 x 50mm) pitch 0.5 mm, SMD components 0402 to QFP (50 x 50 mm) pitch 0.5 mm, Through-hole components (conventional), Paints from PETERS, Hand soldering tools from JBC
- Certificates
- Functional test, Visual inspection, Quality documentation on request
- Industries
- Mid-sized industry, Engineering offices, Electronics
- 01
Material procurement (on request)
- 02
Screen printing (solder/adhesive paste)
- 03
SMD placement
- 04
Reflow/wave/selective soldering or hand soldering
- 05
THT placement (component preparation)
- 06
Small-device/enclosure assembly
- 07
Partial conformal coating/potting
- 08
Functional test and visual inspection
- 09
Shipping/logistics
Processes and Technologies
SMD components 0402 to QFP (50 x 50 mm) pitch 0.5 mm
Placement single-sided and double-sided using the reflow process, in future also vapor phase soldering.
Through-hole components (conventional)
Placement at a light-guided bench, soldered by wave soldering machine or selective soldering machine.
Paints from PETERS
Used for partial conformal coating of printed circuit boards.
Hand soldering tools from JBC
Used exclusively for hand soldering work.
Location

Westerheim
DEProduction/Administration
- Lot size
- Conventional placement up to approx. 100 units, larger volumes on request
- Materials
- SMD and THT components
- Screen printer
- SMD placement machine
- Light-guided placement bench (THT placement)
- Wave soldering machine
- Selective soldering machine
- Reflow machine
- Hand soldering tools (JBC)
- Manual assembly workstations with torque-adjustable electric screwdrivers
Assemblies and Services

Inside the production


Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMD placementAssembly | – | – | – | – | – |
| THT placementAssembly | – | – | – | – | – |
| Mixed placement (SMD + THT)Assembly | – | – | – | – | – |
| Reflow solderingJoining | – | – | – | – | – |
| Selective solderingJoining | – | – | – | – | – |
| Wave solderingJoining | – | – | – | – | – |
| Vapor phase soldering (planned/future)Joining | – | – | – | – | – |
| Hand solderingJoining | – | – | – | – | – |
| Adhesive technology (gluing SMD components onto the solder side)Joining | – | – | – | – | – |
| Screen printing (application of solder paste/adhesive paste)Assembly | – | – | – | – | – |
| Component preparation (bending, cutting, crimping)Assembly | – | – | – | – | – |
| Small-device assembly (assembly into enclosure)Assembly | – | – | – | – | – |
| Functional testing / visual inspectionTesting | – | – | – | – | – |
| Partial conformal coating of printed circuit boards (PETERS paints)Surface | – | – | – | – | – |
| Potting of assembliesPlastics | – | – | – | – | – |
| Material procurement / third-party purchasingEngineering | – | – | – | – | – |
8 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Screen printer | – | – | – | – | Westerheim |
| SMD placement machine | – | – | – | – | Westerheim |
| Light-guided placement bench (THT placement) | – | – | – | – | Westerheim |
| Wave soldering machine | – | – | – | – | Westerheim |
| Selective soldering machine | – | – | – | – | Westerheim |
| Reflow machine | – | – | – | – | Westerheim |
| Hand soldering tools | JBC | – | – | – | Westerheim |
| Manual assembly workstations with torque-adjustable electric screwdrivers | – | – | – | – | Westerheim |
Additional services
Quality Assurance
The production process is continuously quality-monitored: from flawless screen printing through permanent inspection of placement to intermediate and final inspection after the reflow process. Testing is performed using functional test adapters or customer-side test equipment as well as through a comprehensive visual inspection; documentation of quality assurance is offered on request.
| Evidence | Westerheim |
|---|---|
| Functional test | |
| Visual inspection | |
| Quality documentation on request |