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LPT Bestückung – Fertigung

Service provider for SMD, THT and mixed placement of printed circuit boards including soldering, assembly, potting and material procurement

LPT Bestückung Logo

Walter Nägele Leiterplattenbestückung

87784 WesterheimNew on Amplifa

Sole proprietorship, owner Walter NägeleLegal form
WesterheimLocation
approx. 100 unitsSeries size conventional placement (larger volumes on

About us

Walter Nägele Leiterplattenbestückung is a sole proprietorship based in Westerheim (district of Unterallgäu) and works as an outsourcing partner for mid-sized industry as well as for engineering offices. The company produces PCB assemblies from prototype through to series – single-sided and double-sided – in the SMD field as well as conventional (THT) placement. Production includes screen printing of solder and adhesive paste, SMD placement (components from 0402 to QFP 50 x 50 mm, pitch 0.5 mm), reflow soldering, wave soldering, selective soldering and hand soldering; vapor phase soldering is planned. Further services include component preparation (bending, cutting, crimping), adhesive technology, small-device and enclosure assembly with torque-adjustable electric screwdrivers, partial conformal coating of PCBs with PETERS paints as well as potting of tested assemblies. In addition, the company takes on material purchasing on request, carries out functional tests and visual inspections, and offers a pickup and delivery service as well as an express service within five working days with complete material provision.

Site
Westerheim
Processes
SMD placement, THT placement, Mixed placement (SMD + THT), Reflow soldering, Selective soldering, Wave soldering, Vapor phase soldering (planned/future), Hand soldering
Materials
SMD components 0402 to QFP (50 x 50mm) pitch 0.5 mm, SMD components 0402 to QFP (50 x 50 mm) pitch 0.5 mm, Through-hole components (conventional), Paints from PETERS, Hand soldering tools from JBC
Certificates
Functional test, Visual inspection, Quality documentation on request
Industries
Mid-sized industry, Engineering offices, Electronics
  1. 01

    Material procurement (on request)

  2. 02

    Screen printing (solder/adhesive paste)

  3. 03

    SMD placement

  4. 04

    Reflow/wave/selective soldering or hand soldering

  5. 05

    THT placement (component preparation)

  6. 06

    Small-device/enclosure assembly

  7. 07

    Partial conformal coating/potting

  8. 08

    Functional test and visual inspection

  9. 09

    Shipping/logistics

Processes and Technologies

SMD

SMD components 0402 to QFP (50 x 50 mm) pitch 0.5 mm

Placement single-sided and double-sided using the reflow process, in future also vapor phase soldering.

THT

Through-hole components (conventional)

Placement at a light-guided bench, soldered by wave soldering machine or selective soldering machine.

PETERS

Paints from PETERS

Used for partial conformal coating of printed circuit boards.

JBC

Hand soldering tools from JBC

Used exclusively for hand soldering work.

Location

Standort Westerheim

Westerheim

DE

Production/Administration

Lot size
Conventional placement up to approx. 100 units, larger volumes on request
Materials
SMD and THT components
  • Screen printer
  • SMD placement machine
  • Light-guided placement bench (THT placement)
  • Wave soldering machine
  • Selective soldering machine
  • Reflow machine
  • Hand soldering tools (JBC)
  • Manual assembly workstations with torque-adjustable electric screwdrivers

Assemblies and Services

Assembled printed circuit boards (SMD/THT)
Assembled printed circuit boards (SMD/THT)PCB assembly · Electronics

Inside the production

History timeline
History timeline
Production in Westerheim
Production in Westerheim

Industries

Mid-sized industryEngineering officesElectronics

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
SMD placementAssembly–––––
THT placementAssembly–––––
Mixed placement (SMD + THT)Assembly–––––
Reflow solderingJoining–––––
Selective solderingJoining–––––
Wave solderingJoining–––––
Vapor phase soldering (planned/future)Joining–––––
Hand solderingJoining–––––
Adhesive technology (gluing SMD components onto the solder side)Joining–––––
Screen printing (application of solder paste/adhesive paste)Assembly–––––
Component preparation (bending, cutting, crimping)Assembly–––––
Small-device assembly (assembly into enclosure)Assembly–––––
Functional testing / visual inspectionTesting–––––
Partial conformal coating of printed circuit boards (PETERS paints)Surface–––––
Potting of assembliesPlastics–––––
Material procurement / third-party purchasingEngineering–––––

8 Anlagen & Maschinen

MachineManufacturer / modelQuantityWorking areaYear builtSite
Screen printer––––Westerheim
SMD placement machine––––Westerheim
Light-guided placement bench (THT placement)––––Westerheim
Wave soldering machine––––Westerheim
Selective soldering machine––––Westerheim
Reflow machine––––Westerheim
Hand soldering toolsJBC–––Westerheim
Manual assembly workstations with torque-adjustable electric screwdrivers––––Westerheim

Additional services

SMD placementTHT placementMixed placementReflow solderingSelective solderingWave solderingVapor phase soldering (planned)Hand solderingScreen printingAdhesive technologyComponent preparation (bending, cutting, crimping)Small-device assembly/enclosure assemblyTesting (functional test, visual inspection)Material procurementPartial conformal coating of printed circuit boards (PETERS paints)PottingLogistics (pickup and delivery service, express service within 5 working days)Quality assurance

Quality Assurance

The production process is continuously quality-monitored: from flawless screen printing through permanent inspection of placement to intermediate and final inspection after the reflow process. Testing is performed using functional test adapters or customer-side test equipment as well as through a comprehensive visual inspection; documentation of quality assurance is offered on request.

EvidenceWesterheim
Functional test
Visual inspection
Quality documentation on request
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