Xyztec develops Sigma Bond Testers for metrological testing of the mechanical strength of bonds in semiconductor manufacturing.
Xyztec b.v.
New on Amplifa
About Xyztec
Xyztec is a manufacturer of bond testing systems for measuring the mechanical strength of bonds. The product portfolio includes the Sigma Bond Testers as well as the Sigma High Force Bond Tester, complemented by Robotic Handlers for automated loading and unloading of wafers (EFEM), waffle trays and magazines. The systems operate with a measurement accuracy of 0.075% and a relative shear height precision of 200 nm thanks to the closed-loop Nano-Control shear sensor. Automation features include deep-learning image processing with automatic grading of defect images, AOI image measurement with up to three Smart Vision cameras, and data export including SECS/GEM. Technical testing is performed via shear and pull tests on wire bonds, wafer-level applications, coatings and lead frames, with a programmable landing force down to 5 gf. Xyztec offers worldwide service and spare parts through a network of branches, distributors and representatives, as well as a webshop for consumables.
- Processes
- Bond testing (mechanical testing of bond strength: shear and pull tests), Automated bond testing systems (Sigma), Robotic Handlers (EFEM, waffle trays, magazines), Deep-learning image processing / auto grading, AOI image measurement, SECS/GEM data export, Worldwide service and spare parts, Consumables webshop
- Materials
- Wafers (semiconductor substrates), Lead Frames, Coatings, Wire Bonds, Wafer-Level Applications
- Certificates
- SPC functions (cpk, control charts), Auto Grading / AOI, SECS/GEM data export
- Industries
- Semiconductor Manufacturing, Electronics, Wafer-Level Testing
- 01
Evaluation of the test object (grading, wire detection, fiducial recognition)
- 02
Automated loading and unloading via Robotic Handler
- 03
Tool alignment and positioning
- 04
Shear/pull test with nano height control
- 05
Image processing, AOI and auto grading
- 06
Data export and SECS/GEM
- 07
Worldwide service and spare parts
Tested Applications and Objects
Wire Bonds
Testing of the strength of bond wires, including detection of fine-pitch wires.
Wafer-Level Applications
Nano-precise shear testing of critical wafer-level applications.
Lead Frames
Mechanical strength testing on lead frames.
Coatings
Testing of the adhesion and strength of coatings.
Measured Applications
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Bond testing (mechanical testing of bond strength: shear and pull tests)Testing | 0.075% accuracy | – | Landing force down to 5 gf | – | Bonds (wire bonds, wafer-level, coatings, lead frames) |
6 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Bond Tester | xyztec Sigma | – | – | – | – |
| Bond Tester (High Force) | xyztec Sigma High Force | – | – | – | – |
| Robotic Handler (EFEM for wafers, waffle trays, magazines) | xyztec | – | – | – | – |
| Shear Sensor with Nano Height Control (200 nm precision) | xyztec Nano control shear sensor | – | – | – | – |
| Revolving Measurement Unit (RMU) | xyztec | – | – | – | – |
| Smart Vision Camera / AOI (up to 3 cameras) | xyztec | – | – | – | – |
Additional services
Quality and Accuracy
The Sigma Bond Testers achieve an accuracy of 0.075% at 24-bit ADC resolution; the shear height is controlled with 200 nm precision in a closed loop. For process control, SPC functions with control charts, real-time force graphs and defined control rules are available.
| Evidence | Company |
|---|---|
| SPC functions (cpk, control charts) | |
| Auto Grading / AOI | |
| SECS/GEM data export |
History
- 2023
Website relaunch with Sigma Bond Testers