Specialized cleaning media, analytics and process qualification for the precision cleaning of electronic assemblies and power modules.
ZESTRON Europe – a Business Division of Dr. O.K. Wack Chemie GmbH
Baar-Ebenhausen · Ingolstadt · Pulau Pinang (Prai)New on Amplifa
About ZESTRON
ZESTRON Europe is a Business Division of Dr. O.K. Wack Chemie GmbH based in Baar-Ebenhausen near Ingolstadt. The company develops and distributes cleaning media for electronics manufacturing, including water-based, solvent-free, alcohol-based and application-specific cleaners for SMT assemblies, power modules, stencils, solder frames as well as tool and maintenance components. In addition, cleaning processes are qualified, cleaning equipment is compared on a manufacturer-neutral basis, and surface analytics are offered, including FTIR, ion chromatography, ROSE test, SEM/EDX and contact angle measurement. The technical center in Baar-Ebenhausen has 28 cleaning systems from 15 manufacturers available for comparison tests – up to 400 tests and 130 customer visits per year. Beyond cleaning, ZESTRON supports customers with wet-chemical surface modification, risk assessment, failure analysis/remediation and training. The expertise is based on decades of experience in precision cleaning, analytics and interconnect technology of functional surfaces.
- Site
- Baar-Ebenhausen
- Processes
- Precision cleaning of electronic assemblies (spray process), Immersion process with pressure flooding (Spray-under-Immersion), Ultrasonic cleaning, Spray processes in inline and batch systems, Manual cleaning (dipping & brushing), Wet-chemical surface modification, Bath analysis (cleaning and rinse baths), Ion chromatography
- Materials
- FR4 (assemblies/SMT), DCB (Direct Copper Bonded Substrate), AMB (Active Metal Brazed Substrate), Leadframe, Ceramic substrates, Wafers, Tin, Copper
- Certificates
- ISO 9001, ISO/IEC 27001, TISAX
- Founded
- 1992
- Industries
- SMT electronics, Power electronics, Semiconductors/Advanced Packaging, Automotive, Defense & Aerospace, E-Mobility
- 01
Requirements analysis (contamination, assembly, process)
- 02
Cleaner and equipment selection
- 03
Cleaning trials in the technical center
- 04
Cleanliness verification & analytics
- 05
Process qualification & control
- 06
Risk assessment & failure analysis
Cleaner Technologies & Materials
MPC® Technology (VIGON)
Water-based, surfactant-free cleaning technology that removes organic and inorganic contaminants across a broad spectrum.
FAST® Technology (ATRON)
Surfactant cleaners with improved surface wetting for the rapid removal of NoClean flux residues, especially in spray processes.
HYDRON® Technology
Water-based, single-phase cleaning media for assemblies, power electronics, packages, wafers and stencils.
FR4 / SMT Assemblies
Populated printed circuit boards for defluxing and residue removal.
DCB Substrates
Direct Copper Bonded Substrate in power electronics.
AMB Substrates
Active Metal Brazed Substrate for power modules.
Leadframe
Lead frames in power electronics and advanced packaging.
Ceramic Substrates
Substrates for power modules with high cleanliness requirements.
Copper, Nickel, Tin, Aluminum
Metal surfaces for wettability analysis and surface modification.
Locations & Technical Center
Baar-Ebenhausen
DEHeadquarters of ZESTRON Europe with technical center and analytical center
- Lot size
- Comparison tests, single samples up to series processes
- Materials
- Assemblies, power electronics, stencils
- 28 cleaning systems from 15 manufacturers (including Speedline, KED, Crest, Trident, Kerry)
- Spray-in-Air inline & batch systems
- Pressure flood systems (Power-Flooding)
- Ultrasonic cleaning systems
- FTIR, ion chromatography, ROSE, SEM/EDX, contact angle measurement
Ingolstadt
DETechnical center (opened 1994)
Pulau Pinang (Prai)
MYZESTRON South Asia, technical center (Machine Test Centre)
- Lot size
- 300–400 tests per year
- Materials
- SMT, power and semiconductor assemblies
- 28 cleaning systems from 15 manufacturers
- Spray-in-Air, pressure flooding, ultrasonic, manual cleaning
Cleaned Components & Applications
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Precision cleaning of electronic assemblies (spray process)Cleaning/Surface | – | – | – | – | Electronic assemblies (FR4/SMT) |
| Immersion process with pressure flooding (Spray-under-Immersion)Cleaning/Surface | – | – | – | – | Power electronics (DCB/AMB/Leadframe), High-density/Low-standoff components |
| Ultrasonic cleaningCleaning/Surface | – | – | – | – | Stencils & screens, Tool and maintenance components, Power electronics |
| Spray processes in inline and batch systemsCleaning/Surface | – | – | – | – | Assemblies (FR4/SMT), Misprints, Solder frames |
| Manual cleaning (dipping & brushing)Cleaning/Surface | – | – | – | – | Prototyping, local cleaning |
| Wet-chemical surface modificationSurface | – | – | – | – | Metal surfaces in power electronics |
| Bath analysis (cleaning and rinse baths)Testing | – | – | – | – | VIGON®/ATRON®/HYDRON® cleaners, ZESTRON® solvent cleaners, Rinse water |
| Ion chromatographyTesting | – | – | – | – | Electronic assemblies |
| Ionic contamination measurement (ROSE test)Testing | – | – | – | – | Electronic assemblies |
| FTIR microscopy and spectroscopyTesting | – | – | – | – | Electronic assemblies |
| SEM/EDX analysisTesting | – | – | – | – | Electronic assemblies, Power modules |
| Contact angle measurementTesting | ±0.1 mN/m (surface energy) | – | – | – | Polymers of electronic assemblies, Metal surfaces in power electronics |
| C3 Test (Critical Cleaning Control)Testing | – | – | – | – | PCBA |
| CoRe Test (Coating Reliability Test) according to IEC PAS 61191-10Testing | – | – | – | – | Framed Power Modules |
| Risk assessment & failure analysis (root-cause analysis)Engineering | – | – | – | – | – |
| Cleaning process qualification / process developmentEngineering | – | – | – | – | – |
4 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Cleaning systems (technical center, manufacturer-neutral) | various (including Speedline, KED, Crest, Trident, Kerry) | 28 | – | – | Baar-Ebenhausen, Germany |
| Spray-in-Air cleaning systems (inline & batch) | various | – | – | – | – |
| Pressure flood systems (Power-Flooding) | various | – | – | – | – |
| Ultrasonic cleaning systems (multi-chamber/batch) | various | – | – | – | – |
Additional services
Quality & Certification
The processes and systems at the German site are certified according to ISO 9001; information security is safeguarded by ISO/IEC 27001 and TISAX. Cleanliness testing is performed in accordance with international standards such as IPC, MIL and J-STD.
| Evidence | Baar-Ebenhausen |
|---|---|
| ISO 9001 | |
| ISO/IEC 27001 | |
| TISAX |
History
- 1992
Founding of ZESTRON.
- 1994
Opening of the technical center in Ingolstadt and introduction of the first water-based cleaner, VIGON®.
- Mitte der
Expansion into new markets; today eight locations on three continents.