Contract manufacturing of electronic assemblies: SMD/SMT placement, layout development and device assembly from Frankfurt am Main.
ZIECO GmbH
Frankfurt am Main · Tiroler Straße 38a, 60596New on Amplifa
About ZIECO
ZIECO GmbH is an electronics service provider (EMS) based in Frankfurt am Main that develops customer-specific printed circuit board layouts and manufactures electronic assemblies as well as complete end devices. The service spectrum includes SMD/SMT placement of small, medium and large series, prototype construction, assembly and device mounting up to the finished product, and production-optimized material procurement. Development covers analog and digital circuits including EMC-optimized and production-optimized layouts as well as sample boards on modern CAD/CAM systems. Production uses Mydata placement machines with capacities of 8,000 to 10,000 components/h, convection reflow ovens and microprocessor-controlled soldering systems. The offering is rounded off by test concept development, inspection and test procedures, and cost-effective stencil production for solder paste application using a photoplotter.
- Site
- Frankfurt am Main
- Processes
- SMD/SMT placement, Solder paste application (screen printing), Reflow soldering, Hand soldering / conventional soldering, Assembly and device mounting, Prototype construction, Stencil production for solder paste application (photoplot), Layout development (analog/digital, EMC-optimized, CAD/CAM)
- Materials
- SMD/SMT placement, Reflow soldering, Conventional soldering / hand soldering, Layout development, Photoplotter (stencil production)
- Certificates
- ISO 9001
- Industries
- Electronics, Electronics services (EMS), Electronics/Electronics services (EMS)
- 01
Layout development (CAD/CAM)
- 02
Production-optimized material procurement
- 03
Stencil production for solder paste application (photoplot)
- 04
Solder paste application (screen printing)
- 05
SMD/SMT placement
- 06
Reflow soldering
- 07
Conventional soldering / hand soldering
- 08
Inspection and test procedures
- 09
Assembly and device mounting
Processes & Technologies
SMD/SMT placement
Automatic placement of small to large series with integrated verification of components for electrical value and mechanical dimensions.
Reflow soldering
Convection ovens with heating zones controlled on both sides and definable temperature profiles for high-quality solder joints.
Conventional soldering / hand soldering
Soldering of conventional components by hand or on a microprocessor-controlled soldering system.
Layout development
Analog and digital circuits, EMC-optimized and production-optimized layouts including sample boards.
Photoplotter (stencil production)
Cost-effective production of stencils for solder paste application; Gerber data, Eagle-Tiff with Hi-Res BMP and Postscript are processed.
Locations
Frankfurt am Main
DEManufacturing, development and administration
- Lot size
- Prototypes, small, medium and large series
- Materials
- Printed circuit boards, SMD components, conventional components
- Mydata placement machines TP9, TP11, My9
- Cosy Masterpick placement machine
- Harotec convection reflow oven
- Solder paste dispensing machine
- Filmstar photoplotter
- Microprocessor-controlled soldering system
Components & Assemblies
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMD/SMT placementAssembly | – | – | Small series to large series | – | Printed circuit boards, SMD components, conventional |
| Solder paste application (screen printing)Assembly | – | – | – | – | Solder paste |
| Reflow solderingJoining | – | – | – | – | Printed circuit boards, SMD components |
| Hand soldering / conventional solderingJoining | – | – | – | – | conventional components |
| Assembly and device mountingAssembly | – | – | – | – | – |
| Prototype constructionAssembly | – | – | – | – | – |
| Stencil production for solder paste application (photoplot)Engineering | – | – | – | – | – |
| Layout development (analog/digital, EMC-optimized, CAD/CAM)Engineering | – | – | – | – | – |
| Inspection and test proceduresTesting | – | – | – | – | – |
| Material procurementEngineering | – | – | – | – | – |
8 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMD placement machine | Mydata TP9 | – | – | – | Frankfurt am Main |
| SMD placement machine | Mydata TP11 | – | – | – | Frankfurt am Main |
| SMD placement machine | Mydata My9 | – | – | – | Frankfurt am Main |
| Placement machine | Cosy Masterpick | – | – | – | Frankfurt am Main |
| Convection reflow oven | Harotec Reflow | – | – | – | Frankfurt am Main |
| Solder paste dispensing machine | – | – | – | – | Frankfurt am Main |
| Photoplotter (stencil production) | Filmstar | – | – | – | Frankfurt am Main |
| Microprocessor-controlled soldering system | – | – | – | – | Frankfurt am Main |
Additional services
Quality
During the placement process, all components are checked for the correct electrical value and correct mechanical dimensions; an integrated vision system handles optical and mechanical centering. High-precision solder paste dispensing machines and convection reflow ovens with exactly definable temperature profiles ensure manufacturing quality.
| Evidence | Frankfurt am Main |
|---|---|
| ISO 9001 |