Contactless ultrasonic handling systems for wafers and ultra-thin glass substrates
ZS-Handling Technologies GmbH
RegensburgNew on Amplifa
About ZS-Handling Technologies
ZS-Handling Technologies GmbH, based in Regensburg, develops, manufactures, sells and services contactless handling systems based on ultrasonic air bearing technology. The systems enable contactless pick & place, conveying, sorting and loading/unloading of sensitive substrates such as wafers (6", 8", 12"), dies and ultra-thin glass substrates. As the substrate levitates on an ultrasonic air film, surface contact, mechanical stress and particle contamination are avoided; unlike Bernoulli-based systems, no air turbulence is created, and no elaborate compressed-air supply is required – only an electrical connection and optionally a vacuum connection. The portfolio also includes inspection and metrology as well as layout and system planning and production concepts. Customer industries include the semiconductor industry, Advanced Packaging (Hybrid Bonding, FlipChip, Deposition), ultra-thin glass, displays and optics. The company is registered in the commercial register of the District Court of Regensburg (HRB 19308) and is managed by Marc Schmelzinger.
- Site
- Regensburg
- Processes
- Contactless handling (ultrasonic air bearing technology), Wafer handling 6", 8", 12", Die handling, Handling of Ultra-Thin Glass, Contactless pick & place, conveying, sorting, loading/unloading, Inspection and metrology, Contactless ultrasonic handling systems (pick & place, conveying, sorting, loading/unloading), Handling of ultra-thin glass substrates
- Materials
- Silicon, SiC (Silicon Carbide), GaN (Gallium Nitride), Germanium, Glass (Ultra-Thin Glass), Silicon Carbide, Gallium Nitride, Ultra-Thin Glass
- Founded
- 2022
- Industries
- Semiconductor industry, Advanced Packaging, Ultra-thin glass, Displays, Optics
- 01
Development and design
- 02
Layout and system planning
- 03
Production of systems and modules
- 04
Sales
- 05
Maintenance and service
Materials and Substrates
Silicon
Wafer material for wafer handling 6", 8", 12" and die handling.
Silicon Carbide
Supported material for contactless wafer handling in semiconductor manufacturing.
Gallium Nitride
Supported material for contactless wafer handling in semiconductor manufacturing.
Germanium
Supported material for contactless wafer handling.
Ultra-Thin Glass
Crack-free, stress-free handling without surface damage, e.g. for displays and optics.
Ultrasonic Air Bearing Technology
Contactless levitation on a stable ultrasonic air film without the Bernoulli principle and without air turbulence.
Sites
Regensburg
DEHeadquarters with development, production and sales
- Materials
- Silicon, SiC, GaN, Germanium, Glass
- Contactless ultrasonic handling system LeviWafer TS (wafers 6", 8", 12")
Products and Modules
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Contactless handling (ultrasonic air bearing technology)Handling/Automation | – | – | – | – | Silicon, SiC, GaN, Germanium, Glass, Films |
| Wafer handling 6", 8", 12"Handling/Automation | – | – | – | – | Silicon, SiC, GaN, Germanium, Glass |
| Die handlingHandling/Automation | – | – | – | – | Silicon, SiC, GaN, Germanium, Glass |
| Handling of Ultra-Thin GlassHandling/Automation | – | – | – | – | Glass |
| Contactless pick & place, conveying, sorting, loading/unloadingHandling/Automation | – | – | – | – | – |
| Inspection and metrologyTesting | – | – | – | – | – |
| Engineering | – | – | – | – | – |
1 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Contactless ultrasonic handling system (e.g. LeviWafer TS Gripper) | ZS-Handling Technologies GmbH LeviWafer TS | – | Wafers 6", 8", 12" | – | Regensburg |
Additional services
History
- 2022
Founding according to LinkedIn; the Creditreform founding date is not publicly available
- 2024
Last change in the commercial register on 17.12.2024