Semiconductor solutions: power semiconductors based on Si, SiC and GaN, microcontrollers, sensors, security and RF chips.
Infineon Technologies AG
Neubiberg (headquarters) · Dresden (semiconductor plant) · Regensburg · Warstein · Villach (AT, semiconductor plant/R&D) · Kulim (MY) · Hanoi (VN)New on Amplifa
About Infineon Technologies
Infineon Technologies AG is a semiconductor manufacturer that was spun off from Siemens' semiconductor business in 1999 and is managed from its headquarters in Neubiberg near Munich. The company manufactures chips based on silicon, silicon carbide (SiC) and gallium nitride (GaN) – including power semiconductors such as MOSFETs and IGBTs, microcontrollers (including AURIX™), sensors, memories, security controllers as well as RF and connectivity solutions. Manufacturing takes place in its own wafer fabs, among others in Dresden and Villach (200-mm and 300-mm fabrication); this is supplemented by contract manufacturing such as automotive MCU production at UMC. Services include RF foundry services, up-screening for high-reliability applications, wafer and die sales as well as ASIC development. Customer industries include automotive, industrial and energy, edge systems, defense/space as well as government ID and smartcard security. Further sites are located in Regensburg and Warstein as well as in Kulim (Malaysia) and Hanoi (Vietnam). The company employs around 57,000 people.
- Site
- Neubiberg
- Processes
- Semiconductor manufacturing (wafer fabrication), RF foundry services, High-reliability up-screening services, High-reliability die and wafer sales, ASIC development (ASIC Solutions, SoC & SiP), MEMS manufacturing (MEMS microphones, sensors), Villach semiconductor plant (200-mm/300-mm fabrication, EUR 1.6 billion investment), Dresden semiconductor fab (chip fab, approx. EUR 5 billion investment)
- Materials
- Silicon (Si), Silicon carbide (SiC), Gallium nitride (GaN)
- Founded
- 1999
- Employees
- approx. 57,000
- Industries
- Automotive, Industrial/Energy (Power Systems), Edge Systems/Household Appliances, Defense/NewSpace/Space, Government ID, Security/Smartcard
- 01
ASIC engineering and system design
- 02
Wafer fabrication (Si, SiC, GaN)
- 03
Testing/up-screening (high reliability)
- 04
Foundry and wafer/die services
- 05
Assembly and delivery
Materials and Manufacturing Processes
Silicon (Si)
Base material for microcontrollers, power semiconductors, sensors, security and RF chips.
Silicon carbide (SiC)
Wide-bandgap semiconductor for efficient power electronics in automotive and energy applications.
Gallium nitride (GaN)
Used for high-voltage and high-frequency power electronics, also as rad-hard GaN in the space portfolio.
Sites
Neubiberg
DEHeadquarters
Dresden
DESemiconductor plant/fabrication (chip fab, approx. EUR 5 billion investment)
- Materials
- Silicon
- 200-mm/300-mm wafer fabrication
Regensburg
DESite/fabrication
Warstein
DESite
Villach
ATSemiconductor plant and R&D center (EUR 1.6 billion investment)
- Materials
- Silicon, silicon carbide
- 200-mm/300-mm fabrication
Kulim
MYManufacturing site (investment up to EUR 5 billion)
Hanoi
VNDevelopment center (automotive MCU verification, test)
Products and Components
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Semiconductor manufacturing (wafer fabrication)Semiconductor/Chip manufacturing | – | – | – | – | Silicon, Silicon carbide (SiC), Gallium nitride (GaN) |
| RF foundry servicesSemiconductor/Foundry | – | – | – | – | Silicon |
| High-reliability up-screening servicesTesting | – | – | – | – | Silicon |
| High-reliability die and wafer salesSemiconductor/Wafer & Die | – | – | – | – | Silicon |
| ASIC development (ASIC Solutions, SoC & SiP)Engineering | – | – | – | – | Silicon |
| MEMS manufacturing (MEMS microphones, sensors)Semiconductor/MEMS | – | – | – | – | Silicon |
| Villach semiconductor plant (200-mm/300-mm fabrication, EUR 1.6 billion investment)Semiconductor/Chip manufacturing | – | – | – | – | Silicon, Silicon carbide (SiC) |
| Dresden semiconductor fab (chip fab, approx. EUR 5 billion investment)Semiconductor/Chip manufacturing | – | – | – | – | Silicon |
| Automotive MCU contract manufacturing at UMC (40-nm process with embedded non-volatile memory)Semiconductor/Foundry | – | – | – | – | Silicon |
Additional services
History
- 1999
Spin-off of Siemens' semiconductor business (April 1, 1999); IPO in 2000
- 2005
Relocation of company headquarters to Neubiberg near Munich
- 2006
Spin-off of the memory division as Qimonda (approx. 12,000 employees)
- 2009
Qimonda insolvency; sale of Wireline Communications to Golden Gate Capital (Lantiq)
- 2011
Sale of Wireless Solutions to Intel (Intel Mobile Communications)
- 2015
Acquisition of International Rectifier for approx. USD 3 billion completed
- 2018
Largest single investment in company history: EUR 1.6 billion in the Villach site
- 2020
Acquisition of Cypress Semiconductor (approx. EUR 9 billion) completed
- 2021
Construction of the Villach plant completed
- 2023
Acquisitions of GaN Systems (USD 830 million) and Imagimob; investment of up to EUR 5 billion in Kulim; Hanoi development center opened; planned Dresden fab expansion (EUR 5 billion)
- 2024
Cost-cutting program: cutting/relocating 2,800 jobs; approx. 500 layoffs in Regensburg
- 2025
Acquisition of Marvell's automotive Ethernet business for USD 2.5 billion; EU approval of Dresden subsidies (European Chips Act)
- 2026
Opening of the new chip fab in Dresden; acquisition of Ams-Osram's non-optical analog/mixed-signal sensor business (EUR 570 million); participation in quantum technology pilot lines (CHAMP-ION, SUPREME, SPINS); restructuring into three business divisions (ATV, PS, ES); job cuts in Warstein