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Seifert electronic – Fertigung

Custom heat sinks and thermal management solutions for electronics, manufactured in Ennepetal

Seifert electronic Logo

Seifert electronic GmbH

EnnepetalNew on Amplifa

Over 50 yearsExperience in electronics cooling
EnnepetalLocation in North Rhine-Westphalia
Up to 900 mmProfile width for IGBT cooling

About Seifert electronic

Seifert electronic GmbH from Ennepetal has been manufacturing custom heat sinks for the safe dissipation of heat from electronic components for over 50 years. The product portfolio includes standard and profile heat sinks, high-performance heat sinks, skived heat sinks (Flexfin), bonded-fin heat sinks for forced cooling, pressure-tested liquid-cooled heat sinks, PC board elements, as well as thermal conductive and insulating products. Manufacturing covers extruded profiles in nearly all desired dimensions, CNC machining, cutting to length, deburring, side punching, skiving, joining including friction stir welding (FSW), surface treatments such as (partial) anodizing, as well as assembly and testing. In addition to its catalog program, the company develops customer-specific special profiles with exclusive usage rights and advises on the design of thermally optimized heat sinks. Customer industries include wind power, rail technology, laser technology, LED lighting, board-level electronics, solar applications and inverters. As a member of the Heat Sink Group, the company is also present at trade fairs such as the Evertiq Expo.

Site
Ennepetal
Processes
Skiving (Flexfin skived heat sinks), Extruded profiles (cooling profiles), Cutting to length, CNC machining, Milling of cooling channels (liquid-cooled heat sinks), Side punching / punching of profiles, Stamped and bent parts, Deburring
Materials
Aluminium, Thermoplastic, Beryllium copper, Brass, Aluminium EN AW-6060, Aluminium EN AW-6063, Thermoplastic PBTP 841 FR, Thermoplastic PCT CG 923
Certificates
In-house testing and data sheets
Industries
Wind power, Rail technology, Laser technology, LED, Circuit boards/Electronics, Solar applications
  1. 01

    Consulting and design of cooling profiles

  2. 02

    Extruded profiles and skiving

  3. 03

    Cutting to length and CNC machining

  4. 04

    Joining (including friction stir welding)

  5. 05

    Surface treatment (anodizing)

  6. 06

    Testing and marking

  7. 07

    Assembly and shipping

Materials and Processes

EN AW-6060

Aluminium EN AW-6060

Extrusion alloy for cooling profiles, thermally aged for optimal thermal conductivity.

EN AW-6063

Aluminium EN AW-6063

Extrusion alloy for cooling profiles, thermally aged for optimal thermal conductivity.

PBTP 841 FR

Thermoplastic PBTP 841 FR

Self-extinguishing thermoplastic for sockets and insulating bodies in accordance with UL 94 V-0.

PCT CG 923

Thermoplastic PCT CG 923

Heat-resistant thermoplastic for mounting washers and diode holders up to 290 °C.

BeCu

Beryllium copper

Precision collet contacts in IC sockets with gold-plated surface.

CuZn37

Brass CuZn37

Contact pins in sockets, surface finished by tinning or gold plating.

SK

Skiving

Flexfin skiving process for heat sinks with flexible fins made from a single piece of aluminium.

FSW

Friction stir welding (FSW)

Joining process for large heat sinks made from existing extruded profiles.

EX

Anodizing

Surface treatment of heat sinks, also partial anodizing using masking.

Site

Ennepetal

DE

Headquarters and manufacturing

Materials
Aluminium (EN AW-6060/6063), thermoplastics, beryllium copper, brass
  • CNC machining
  • Cutting to length
  • Deburring
  • Skiving (Flexfin)
  • Friction stir welding (FSW)
  • Surface treatment/anodizing
  • Assembly
  • Testing

Components

Flexfin skived heat sink
Flexfin skived heat sinkSkiving · Electronics
Profile heat sink
Profile heat sinkExtrusion · Electronics
High-performance heat sink
High-performance heat sinkComb profile · Power electronics
Disc cell cooling
Disc cell coolingAssembly · Power electronics

Inside the production

Flexfin skiving trade fair wall
Flexfin skiving trade fair wall
Trade fair presence Evertiq Expo
Trade fair presence Evertiq Expo
Heat sink industry world
Heat sink industry world

Industries

Wind powerRail technologyLaser technologyLEDCircuit boards/ElectronicsSolar applicationsInverters/Power electronics

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
Skiving (Flexfin skived heat sinks)Forming––––Aluminium
Extruded profiles (cooling profiles)Forming––––Aluminium
Cutting to lengthMachining––––Aluminium
CNC machiningMachining––––Aluminium
Milling of cooling channels (liquid-cooled heat sinks)Machining––––Aluminium
Side punching / punching of profilesForming––––Aluminium
Stamped and bent partsForming––––Aluminium
DeburringSurface––––Aluminium
DegreasingSurface––––Aluminium
Surface treatments / anodizing (also partial anodizing with masking)Surface––––Aluminium
JoiningJoining––––Aluminium
Friction stir welding (FSW) of cooling profilesJoining––––Aluminium
AssemblyAssembly–––––
Special testingTesting–––––
MarkingSurface–––––
Heat treatment (hardening/thermal ageing) of aluminium alloysHeat treatment––––Aluminium
Thermal ageing of heat sink alloys EN AW-6060 and 6063Heat treatment––––EN AW-6060, EN AW-6063
Design of cooling profiles (development of custom heat sink solutions)Engineering––––Aluminium

Additional services

Custom heat sink special solutionsCNC machiningCutting to lengthDeburringJoiningDegreasingSurface treatments (including anodizing)SkivingAssemblySpecial testingMarkingDesign consulting for cooling profilesTechnical consulting and heat sink consulting

Quality

The company performs special tests on its heat sinks and documents thermal values such as thermal resistance and pressure drop in product data sheets.

EvidenceEnnepetal
In-house testing and data sheets

History

  1. Founding – the company has been cooling electronics for over 50 years

  2. 2026

    Premiere at the Evertiq Expo in Lund (Sweden) with high-performance cooling and the new WieLeco solution

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