Develops 3D CapRAM – Computing inside 3D Flash for AI hardware.
SEMRON GmbH
Dresden (Germany) · Austin, TX (USA)New on Amplifa
About SEMRON
SEMRON GmbH, based in Dresden, develops 3D CapRAM, a memory and compute technology that performs computing operations directly in 3D flash memory (Computing inside 3D Flash). The company thereby addresses the growing demand for efficient hardware for AI applications and positions the technology as an alternative to conventional DRAM-based architectures. Development work takes place in Dresden; the company also maintains a site in Austin, Texas. The founders and managing directors are Aron Kirschen (CEO) and Kai-Uwe Demasius (CTO). The advisory board includes, among others, Hermann Hauser (founder of ARM), Hans Rohrer (former President TSMC Europe) and Alex Kalnitsky (former VP R&D at TSMC). SEMRON publishes the results of its research work, among other outlets, in IEEE publications as well as in its own blog and performance paper.
- Site
- Dresden
- Processes
- Development of 3D CapRAM – Computing inside 3D Flash (memory/compute technology for
- Materials
- Computing inside 3D Flash
- Industries
- Artificial Intelligence, Semiconductors, Computer Architecture / AI Hardware
- 01
Research & Development
- 02
Chip/Architecture Design
- 03
Publication & Technology Licensing
Technology & Processes
Computing inside 3D Flash
Memory-integrated computing technology for AI hardware, developed as an alternative to DRAM-based architectures.
Locations
Dresden
DEHeadquarters and Development
Austin
USSite (Job Board)
Industries
Additional services