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Develops 3D CapRAM – Computing inside 3D Flash for AI hardware.

SEMRON Logo

SEMRON GmbH

Dresden (Germany) · Austin, TX (USA)New on Amplifa

GmbHLegal Form
HRB 39815, Amtsgericht DresdenCommercial Register
DE329034755VAT ID

About SEMRON

SEMRON GmbH, based in Dresden, develops 3D CapRAM, a memory and compute technology that performs computing operations directly in 3D flash memory (Computing inside 3D Flash). The company thereby addresses the growing demand for efficient hardware for AI applications and positions the technology as an alternative to conventional DRAM-based architectures. Development work takes place in Dresden; the company also maintains a site in Austin, Texas. The founders and managing directors are Aron Kirschen (CEO) and Kai-Uwe Demasius (CTO). The advisory board includes, among others, Hermann Hauser (founder of ARM), Hans Rohrer (former President TSMC Europe) and Alex Kalnitsky (former VP R&D at TSMC). SEMRON publishes the results of its research work, among other outlets, in IEEE publications as well as in its own blog and performance paper.

Site
Dresden
Processes
Development of 3D CapRAM – Computing inside 3D Flash (memory/compute technology for
Materials
Computing inside 3D Flash
Industries
Artificial Intelligence, Semiconductors, Computer Architecture / AI Hardware
  1. 01

    Research & Development

  2. 02

    Chip/Architecture Design

  3. 03

    Publication & Technology Licensing

Technology & Processes

3D CapRAM

Computing inside 3D Flash

Memory-integrated computing technology for AI hardware, developed as an alternative to DRAM-based architectures.

Locations

Dresden

DE

Headquarters and Development

Austin

US

Site (Job Board)

Industries

Artificial IntelligenceSemiconductorsComputer Architecture / AI Hardware

Additional services

Development of 3D CapRAM – Computing inside 3D Flash (memory/compute technology for
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