EMS provider for assembly, soldering, mounting and testing of electronic modules and devices
Smyczek GmbH
Verl (company headquarters and warehouse) · Delbrück · Delbrück OT OstenlandNew on Amplifa
About Smyczek
Smyczek GmbH is an EMS (Electronic Manufacturing Services) company based in Verl, East Westphalia. Its core business is the manufacturing and assembly of electronic modules and devices, with a focus on Surface Mounted Technology (SMT) with a total of 32 SMT production lines across a factory floor area of approximately 28,800 m². In addition, the company offers THT assembly, wave and selective soldering, laser soldering, terminal mounting, conformal coating and potting, device assembly, rework from SMD to BGA, and functional testing (ICT, FT, X-Ray). Logistics include worldwide procurement, end-to-end traceability, automated picking and just-in-time delivery. Since December 2009, Smyczek has been a member of the Beckhoff Automation group; it employs more than 450 staff and generated revenue of €42.7 million (2025). Capacity is around 76 million components per week, with production in small and large volumes at the Verl, Delbrück and Delbrück OT Ostenland sites.
- Site
- Verl
- Processes
- SMT assembly (Surface Mounted Technology), THT assembly (Through-Hole Technology), Wave soldering, Selective soldering, Laser soldering (with XPlanar technology), Terminal mounting, Device assembly (complete device units), Conformal coating/potting
- Materials
- Printed circuit boards (PCB), Solder paste, Surface Mounted Technology, Through-Hole Technology, Printed Circuit Board Assembly (PCB), Dispensing and bonding processes, Rework
- Certificates
- ISO 9001:2015, ISO 50001:2018, IPC-A-610
- Founded
- 1985
- Employees
- >450
- Industries
- EMS services (Electronic Manufacturing Services), Electronics industry, Automation technology
- 01
Worldwide procurement and incoming goods inspection
- 02
Storage (dry tower, paternoster) and traceability
- 03
Stencil printing and dispensing
- 04
SMT assembly on 32 lines
- 05
THT assembly, wave, selective and laser soldering
- 06
Terminal mounting, conformal coating/potting, device assembly
- 07
Testing (SPI, AOI, THT-AOI, AXI, ICT, FT)
- 08
Panel depaneling, laser marking
- 09
Logistics and automated picking
Manufacturing processes
Surface Mounted Technology
Assembly of electronic components on the PCB surface on 32 lines with stencil printing, SPI, inert gas soldering and AOI.
Through-Hole Technology
Assembly of wired components with wave, selective and laser soldering as well as automatic special insertion machines.
Printed Circuit Board Assembly (PCB)
Production of assembled PCBs in small to large volumes with end-to-end traceability.
Dispensing and bonding processes
15 inline and 6 offline dispenser modules for bonding processes and selective solder paste application.
Rework
Repairs from the smallest SMD components up to BGAs.
Sites
Verl
DECompany headquarters, production and SMT manufacturing
- Lot size
- Small to large volumes
- Materials
- PCBs, SMD/THT components
- SMT lines
- Ersa Powerflow wave soldering systems
- Ersa Versaflow selective soldering systems
- Seho Powerselektiv
- Göpel OptiCon THT-AOI
- Asys depaneling routers Divisio2100
- Asys depaneling saws Divisio4000
- Apollo Seiko soldering robots
- Trumpf laser markers TruMark1000/3000
- Eutect laser soldering system with XPlanar
- Automated SMD storage system (dry tower)
Verl (warehouse)
DEWarehouse, 6,100 pallet spaces
- Shelving racks
- Automated barcode reading station
Delbrück OT Ostenland
DEProduction and SMT manufacturing (lines relocated since 2017)
- Materials
- PCBs, SMD/THT components
- SMT lines
- Photovoltaic system
Delbrück
DEProduction and module assembly (since 2023)
- Materials
- PCBs, electronic modules
Modules
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMT assembly (Surface Mounted Technology)Assembly | – | – | – | small volumes – large volumes | electronic components, PCBs |
| THT assembly (Through-Hole Technology)Assembly | – | – | – | – | electronic components, PCBs |
| Wave solderingJoining | – | – | – | – | PCBs |
| Selective solderingJoining | – | – | – | – | PCBs |
| Laser soldering (with XPlanar technology)Joining | – | – | – | – | PCBs |
| Terminal mountingAssembly | – | – | – | – | PCBs |
| Device assembly (complete device units)Assembly | – | – | – | – | electronic modules |
| Conformal coating/pottingSurface treatment | – | – | – | – | PCBs |
| Depaneling (routing and sawing)Machining | – | – | – | – | PCBs |
| Laser marking of PCBsSurface treatment | – | – | – | – | PCBs |
| Rework/repairs (SMD to BGA)Assembly | – | – | – | – | SMD components, BGA |
| Functional testing (ICT, FT, HSpg, X-Ray)Testing | – | – | – | – | electronic modules |
| AOI (automated optical inspection)Testing | – | – | – | – | PCBs |
| SPI (2D and 3D print image inspection)Testing | – | – | – | – | solder paste, PCBs |
| X-ray inspection (AXI)Testing | – | – | – | – | PCBs |
| Dispensing (bonding processes/selective solder paste application)Assembly | – | – | – | – | adhesive, solder paste |
| Stencil printing (inline stencil printers)Assembly | – | – | – | – | solder paste |
| Component programming (SG3000 programming device)Assembly | – | – | – | – | electronic components |
| Taping of components / component countingAssembly | – | – | – | – | SMD components |
| Logistics and automated picking / traceabilityAssembly | – | – | – | – | – |
34 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMT production lines | – | 32 | – | – | Verl/Delbrück |
| SMT placement modules | Yamaha YSM module | – | – | 2018 | Verl |
| Inline dispenser modules | – | 15 | – | – | – |
| Offline dispenser modules | – | 6 | – | – | – |
| Inline X-ray inspection systems | – | 4 | – | – | – |
| Stencil laser | LPKF | 2 | – | 2012 | – |
| Wave soldering system | Ersa Powerflow | 3 | – | – | – |
| Selective soldering system | Ersa Versaflow | 4 | – | – | – |
| Selective soldering system | Seho Powerselektiv | 2 | – | – | – |
| THT special insertion machines (automatic) | Panasonic NPM-VF | 2 | – | – | – |
| THT-AOI | Göpel OptiCon BasicLine | 7 | – | – | – |
| Laser soldering system | Eutect with XPlanar | 1 | – | 2022 | – |
| Robotic system | Hesse wire bond robot | – | – | – | – |
| Depaneling router | Asys Divisio2100 | 4 | – | – | – |
| Depaneling router | Asys SAR1000 | – | – | 2007 | – |
| Depaneling saw | Asys Divisio4000 | 2 | – | 2019/2022 | – |
| Soldering robot | Apollo Seiko | 12 | – | – | – |
| Laser marker | Trumpf TruMark1000 | 12 | – | – | – |
| Laser marker | Trumpf TruMark3000 | 4 | – | – | – |
| ICT tester | Digitaltest | – | – | 2016 | – |
| AXI X-ray inspection system | Omron | 1 | – | 2015 | – |
| SPI systems | CKD | 7 | – | 2015 | – |
| SPI technology | Viscom | – | – | 2011 | – |
| AOI | Viscom | – | – | 1997/2000 | – |
| X-ray inspection | Phönix X-Ray | – | – | 2005 | – |
| X-ray counting device | – | 1 | – | 2017 | – |
| Soldering iron robot | Elmontec | 2 | – | 2019 | – |
| Automated SMD storage system (dry tower) | – | 1 | – | 2019 | Verl |
| Paternoster systems | – | – | – | – | – |
| Automated incoming goods inspection | Vitronic camera | – | – | – | – |
| Programming device | SG3000 | – | – | 2025 | – |
| 3D printer | – | – | – | 2024 | – |
| Automated barcode reading station | – | 1 | – | 2019 | Verl |
| Scanner systems for container capture | – | 2 | – | 2017 | – |
Additional services
Quality
Smyczek is certified to DIN ISO 9001:2015 and ISO 50001:2018 (DEKRA); the manufacturing process follows the acceptance guideline IPC-A-610. The test equipment includes SPI systems, AOI, THT-AOI, inline X-ray and AXI systems as well as ICT and functional testing.
| Evidence | Verl | Delbrück |
|---|---|---|
| ISO 9001:2015 | ||
| ISO 50001:2018 | ||
| IPC-A-610 |
History
- 1978
The company's origins date back to 1978.
- 1985
Founded by Beate Smyczek with a production area of 300 m².
- 1987
Conversion into a limited partnership (KG) with Roland Smyczek as limited partner; the current form since 1987 (PCB manufacturing, test field services, automation modules CAM/CAQ).
- 1990
Expansion to 600 m², introduction of SMT.
- 1995
Expansion to 1,100 m², three SMT lines in operation.
- 1997
Certification to DIN ISO 9002 by BVQI, introduction of the Viscom AOI.
- 2000
Expansion to 1,500 m², four SMT lines and two Viscom AOIs.
- 2003
Installation of the Versaflow selective soldering system.
- 2005
Relocation of operations to Verl, expansion of production area to 3,000 m², introduction of Phönix X-Ray X-ray inspection.
- 2008
Expansion to 4,500 m², introduction of the ERP system (Infor), installation of an Ersa Powerflow wave soldering system and a Seho Powerselektiv soldering system.
- 2009
Member of the Beckhoff Automation group (since 1.12.2009), installation of the first Göpel OptiCon THT-AOI.
- 2013
Introduction of end-to-end traceability and paperless production.
- 2015
Certification of the energy management system to EN 50001, installation of seven SPI systems (CKD) and the first Omron AXI.
- 2017
Relocation of module assembly and five SMT lines to the Delbrück Ostenland site.
- 2019
Move into the new building, expansion of the Verl headquarters by 10,000 m², installation of the dry tower.
- 2022
New warehouse building in Verl with 2,250 m² and 6,100 pallet spaces.
- 2023
Roland Smyczek retires, Michael Schlegel becomes sole managing director; expansion of the Delbrück site by 6,500 m².
- 2024
31 SMT lines in total, commissioning of the photovoltaic system in Ostenland, new website.
- 2025
Additional SMT line in operation (32 in total), revenue €42.7 million, commissioning of the SG3000 programming device.