Solutions for modern electronics manufacturing: from component logistics and assembly to soldering and inspection.
Systronics AG
Switzerland (headquarters)New on Amplifa
About Systronics
Systronics AG is a Switzerland-based company offering solutions for modern electronics manufacturing (SMT/EMS). Its portfolio includes component logistics, PCB handling, stencil-free jetting and printing of solder paste and adhesive (including the Mycronic MY700JP), SMD and THT assembly, vapor phase, selective and convection soldering, dispensing and coating, AOI inspection, and PCB separation/depaneling. The offering is complemented by accessories, software and process analysis, used machinery, as well as service and commissioning. Systronics works with technology and market leaders and supports customers personally from evaluation through commissioning to ongoing production. The focus is on Switzerland; the main contact for telephone and e-mail is the headquarters.
- Site
- Switzerland (headquarters)
- Processes
- Jet printing (stencil-free solder paste application), Component logistics, PCB handling, Solder paste and adhesive application by jetting and printing, SMD & THT assembly, Vapor phase soldering, Selective soldering, Convection soldering (reflow soldering and thermal treatment)
- Materials
- Solder paste, Adhesive
- Certificates
- ISO 9001
- Industries
- Electronics manufacturing (SMT/EMS)
- 01
Consulting & Evaluation
- 02
Component Logistics & PCB Handling
- 03
Jetting & Printing (Solder Paste, Adhesive)
- 04
SMD & THT Assembly
- 05
Soldering (Vapor Phase, Selective, Convection)
- 06
Dispensing & Coating
- 07
AOI & Inspection
- 08
PCB Separation/Depaneling
- 09
Service & Commissioning
Materials & Processes
Solder paste
Applied by stencil-free jetting and printing with individually controllable volume.
Adhesive
Applied by jetting and printing for SMT processes.
Sites
Switzerland
CHHeadquarters
- Mycronic MY700JP jet printing system (stencil-free solder paste application)
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Jet printing (stencil-free solder paste application)Joining | – | – | – | – | Solder paste |
| Component logisticsAssembly | – | – | – | – | – |
| PCB handlingAssembly | – | – | – | – | – |
| Solder paste and adhesive application by jetting and printingJoining | – | – | – | – | Solder paste, Adhesive |
| SMD & THT assemblyAssembly | – | – | – | – | – |
| Vapor phase solderingJoining | – | – | – | – | – |
| Selective solderingJoining | – | – | – | – | – |
| Convection soldering (reflow soldering and thermal treatment)Joining | – | – | – | – | – |
| Dispensing, painting, metering, conformal coating, underfill, dam & fillSurface | – | – | – | – | – |
| AOI & inspectionTesting | – | – | – | – | – |
| PCB separation (depaneling)Machining | – | – | – | – | – |
| Software & process analysis / troubleshootingEngineering | – | – | – | – | – |
1 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Jet printing system (stencil-free solder paste application) | Mycronic MY700JP | – | – | – | Switzerland |
Additional services
Quality
Smart inspection solutions (AOI) and process analysis ensure quality in electronics manufacturing.
| Evidence | Switzerland |
|---|---|
| ISO 9001 |