Technology service provider for microelectronic packaging, EMS services and HD image sensors from in-house development
viimagic GmbH
MittweidaNew on Amplifa
About viimagic
viimagic is a technology service provider based in Mittweida in the field of microelectronic packaging as well as a technology and development partner for manufacturing solutions and concepts in assembly and interconnection technology (AVT). The company offers industry-proven packaging solutions for demanding requirements, conceptual consulting, development services, and prototype and series production of components and assemblies as EMS services. Its manufacturing competencies include prototype assemblies and prototyping of ICs in ceramic and plastic packages, chip-on-board (CoB), flip-chip and 3D technologies, as well as series production of electronic individual components and assemblies to customer requirements. In addition, reliability studies, failure and material analyses are performed on semiconductor components and modules. Furthermore, viimagic sells high-resolution 2/3" HD CMOS image sensors from its own development and is a partner in R&D projects and cooperation networks.
- Site
- Mittweida
- Processes
- Microelectronic packaging / assembly and interconnection technology (AVT) for sensors and electronic, Prototype assemblies/prototyping of ICs (ceramic and plastic packages), Chip on Board (CoB) technologies, Flip-chip technology, 3D technologies (assembly and interconnection technology), Series production of electronic individual components and assemblies (EMS), Reliability studies, failure and material analyses on semiconductor components and modules, R&D, feasibility studies, manufacturing concepts and consulting in the field of AVT / EMS
- Materials
- Microelectronic Packaging (Assembly and Interconnection Technology), Chip on Board / Flip Chip / 3D Technologies, Ceramic packages, Plastic packages, Printed Circuit Boards, Electronic Manufacturing Services
- Certificates
- Reliability studies and failure analyses, Accompanying quality monitoring, Quality training (EMS)
- Industries
- Microelectronics/Semiconductors, Electronics Manufacturing Services (EMS), Image sensor technology/Machine vision
- 01
Consulting and feasibility studies (AVT/EMS)
- 02
Manufacturing concept and PCB layout support
- 03
Prototyping / prototype assembly of ICs (ceramic and plastic packages)
- 04
CoB, flip-chip and 3D assembly
- 05
Series production of components and assemblies (EMS)
- 06
Quality monitoring, reliability and material analysis
- 07
Sales of in-house image sensors
Materials and Technologies
Microelectronic Packaging (Assembly and Interconnection Technology)
Technology development and manufacturing services for sensors and electronic assemblies.
Chip on Board / Flip Chip / 3D Technologies
Assembly processes for mounting semiconductor chips directly onto substrates or in advanced assembly variants.
Ceramic packages
Package variant for prototype assemblies and prototyping of ICs.
Plastic packages
Cost-effective package variant for prototyping and IC assemblies.
Printed Circuit Boards
Base material for electronic assemblies in prototype and series production.
Electronic Manufacturing Services
Prototype and series production of electronic individual components and assemblies to customer requirements.
Sites
Mittweida
DEHeadquarters with development, packaging production and EMS
- Lot size
- Prototypes to series
- Materials
- Ceramic, plastic, PCB, semiconductor chips
Services and Assemblies
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Microelectronic packaging / assembly and interconnection technology (AVT) for sensors and electronicAssembly | – | – | – | – | Ceramic, Plastic (package materials) |
| Prototype assemblies/prototyping of ICs (ceramic and plastic packages)Assembly | – | – | – | – | Ceramic, Plastic |
| Chip on Board (CoB) technologiesAssembly | – | – | – | – | Semiconductors (chips) |
| Flip-chip technologyAssembly | – | – | – | – | Semiconductors (chips) |
| 3D technologies (assembly and interconnection technology)Assembly | – | – | – | – | Semiconductors (chips) |
| Series production of electronic individual components and assemblies (EMS)Assembly | – | – | – | – | PCB, Electronic components |
| Reliability studies, failure and material analyses on semiconductor components and modulesTesting | – | – | – | – | Semiconductors |
| R&D, feasibility studies, manufacturing concepts and consulting in the field of AVT / EMSEngineering | – | – | – | – | – |
| Support with layout creation (PCB) and specifications (PCB, packages, materials)Engineering | – | – | – | – | PCB, Package and materials |
Additional services
Quality
In the field of quality, accompanying monitoring and analysis activities as well as reliability studies and failure analyses on semiconductor components and modules are offered.
| Evidence | Mittweida |
|---|---|
| Reliability studies and failure analyses | |
| Accompanying quality monitoring | |
| Quality training (EMS) |