Manufacturer of discrete semiconductors and passive electronic components such as diodes, MOSFETs, resistors, capacitors and inductors.
Vishay Intertechnology, Inc.
Malvern (US) · Selb · Heide · Heilbronn · Landshut · ItzehoeNew on Amplifa
About Vishay Intertechnology
Vishay Intertechnology is a US-based manufacturer of discrete semiconductors and passive electronic components headquartered in Malvern, Pennsylvania. The portfolio includes diodes, rectifiers, MOSFETs including silicon carbide devices, power modules, optoelectronics, as well as resistors, capacitors (aluminum electrolytic, ceramic, film, polymer, tantalum), inductors, sensors and other components. Manufacturing takes place in its own production facilities in 17 countries; in Germany there are sites in Selb (European headquarters, formerly Draloric), Heide (formerly Beyschlag), Heilbronn (formerly Temic/Telefunken), Landshut (formerly Roederstein) and Itzehoe (formerly Siliconix) with around 1,900 employees. The components are used, among other things, in automotive, aerospace, industrial, medical, computer, consumer and telecommunications electronics. In 2024, the publicly listed company (NYSE) achieved revenue of USD 2.9 billion and employed approximately 22,700 people.
- Site
- Malvern, PA (US headquarters); Selb (European headquarters)
- Processes
- Manufacture of discrete semiconductors (diodes, rectifiers, thyristors), MOSFET manufacturing (incl. Silicon Carbide MaxSiC MOSFETs), Manufacture of power modules (IGBT, MOSFET, diode, thyristor, bridge modules), Thick-film resistors (Thick Film Power Resistor, Vishay Sfernice), Surface-mount (SMD) components compatible with reflow soldering processes up to 270 °C for 10 s, Manufacture of capacitors (aluminum electrolytic, ceramic, film, polymer, tantalum, thin film,, Manufacture of inductors, transformers, planar magnetics and custom magnetics, Optoelectronics manufacturing (optocouplers, IR emitters, photodetectors, LEDs, optical sensors)
- Materials
- Silicon, Silicon carbide, Tantalum, Aluminum (electrolytic capacitors), Ceramic, Plastic film (film capacitors), Copper (die bonding, coils), Aluminum
- Founded
- 1962
- Employees
- 22,700
- Industries
- Automotive, Aerospace, Defense, Computer, Consumer, Industrial, Medical technology
- 01
Semiconductor manufacturing (dies and wafers)
- 02
Die bonding and module assembly
- 03
Power module assembly
- 04
Production of passive components (resistors, capacitors, inductors)
- 05
Testing and qualification
- 06
Worldwide distribution
Materials and Technologies
Silicon
Base material for diodes, MOSFETs, ICs, optoelectronics and die/wafer products.
Silicon carbide
Used in MaxSiC® MOSFETs for power electronics applications.
Tantalum
Material for tantalum and wet tantalum capacitors.
Aluminum
Basis for aluminum electrolytic capacitors.
Ceramic
Substrate and dielectric material for ceramic capacitors and thick-film resistors.
Plastic film
Dielectric for film capacitors.
Copper
Used for die bonding, coils and increased copper content in power packages.
Ferrite
Core material for inductors, transformers and planar magnetics.
Sites
Malvern
USHeadquarters
Selb
DEProduction site (formerly Draloric), European headquarters
Heide
DEProduction site (formerly Beyschlag)
Heilbronn
DEProduction site (formerly Temic/Telefunken)
Landshut
DEProduction site (formerly Roederstein)
Itzehoe
DESite (formerly Siliconix)
Components
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Manufacture of discrete semiconductors (diodes, rectifiers, thyristors)Semiconductors | – | – | – | – | Silicon, Silicon carbide |
| MOSFET manufacturing (incl. Silicon Carbide MaxSiC MOSFETs)Semiconductors | – | – | – | – | Silicon, Silicon carbide |
| Manufacture of power modules (IGBT, MOSFET, diode, thyristor, bridge modules)Assembly | – | – | – | – | Silicon, Silicon carbide |
| Thick-film resistors (Thick Film Power Resistor, Vishay Sfernice)Electronics | – | – | – | – | Thick-film pastes, Ceramic |
| Surface-mount (SMD) components compatible with reflow soldering processes up to 270 °C for 10 sAssembly | – | – | – | – | Copper, Ceramic |
| Manufacture of capacitors (aluminum electrolytic, ceramic, film, polymer, tantalum, thin film,Electronics | – | – | – | – | Aluminum, Tantalum, Ceramic, Plastic films, Polymer |
| Manufacture of inductors, transformers, planar magnetics and custom magneticsElectronics | – | – | – | – | Copper, Ferrite |
| Optoelectronics manufacturing (optocouplers, IR emitters, photodetectors, LEDs, optical sensors)Semiconductors | – | – | – | – | Silicon, Gallium arsenide (inferred) |
| Custom Products: die and wafer manufacturing, modules, custom capacitors/resistors/magneticsSemiconductors | – | – | – | – | Silicon, Silicon carbide |
Additional services
History
- 1962
Founded by Felix Zandman with foil resistors and strain gauges; named after Veisiejai
- 1985
Acquisition of Dale Electronics; start of the acquisition strategy
- 1987
Acquisition of Draloric
- 1988
Acquisition of Sfernice
- 1992
Acquisition of Sprague Electric
- 1993
Acquisition of Roederstein
- 1994
Acquisition of Vitramon
- 1998
Acquisition of Siliconix and Telefunken
- 2000
Acquisition of Electro-Films, Cera-Mite and Spectrol
- 2001
Acquisition of General Semiconductor and Infineon's infrared business
- 2002
Acquisition of BCcomponents (Beyschlag), BLH, Celtron, Sensortronics and Tedea-Huntleigh
- 2007
Acquisition of International Rectifier's Power Control Systems business
- 2008
Acquisition of KEMET's wet tantalum capacitor business
- 2010
Spin-off of Vishay Precision Group (VPG)
- 2012
Acquisition of HiRel Systems
- 2023
Agreement to purchase the Inmos fab from Nexperia for USD 177 million